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High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold and Green Solder Mask for Industrial Servers

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Shenzhen Bicheng Electronics Technology Co., Ltd

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High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold and Green Solder Mask for Industrial Servers

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Brand Name :	Bicheng Technologies Limited
Model Number :	BIC-503-V0.53
Certification :	UL
Price :	USD 2.99-9.99 PER PIECE
Payment Terms :	T/T, Western Union
Supply Ability :	45000 pieces per month
Delivery Time :	10 working days

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High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold and Green Solder Mask for Industrial Servers

High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold and Green Solder Mask for Industrial Servers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

This is a type of High-Tg 4-layer PCB Built on TU-768 material. Each layer is plated with 1oz copper. Soldering pads are coated with immersion gold and non-pads are with green solder mask. The panel consists of 16 boards with a size of 320 x 280mm. The core is 0.8mm thick, finished PCB achieves 1.2mm thick.

Main Applications

Consumer Electronics

Server, workstation

Automotive

PCB Specifications

Item	Description	Requirement	Actual	Result
1. Laminate	Material Type	FR-4 TU-768	FR-4 TU-768	ACC
	Tg	170℃	170℃	ACC
	Supplier	Taiwan Union (TU)	Taiwan Union (TU)	ACC
	Thickness	1.2±10% mm	1.18-1.21mm	ACC
2.Plating thickness	Hole Wall	≥25µm	26.15µm	ACC
	Outer copper	35µm	37.85µm	ACC
	Inner Copper	30µm	31.15µm	ACC
3.Solder mask	Material Type	TAIYO/ PSR-2000GT600D	PSR-2000GT600D	ACC
	Color	Green	Green	ACC
	Rigidity (Pencil Test)	≥4H or above	5H	ACC
	S/M Thickness	≥10µm	19.55µm	ACC
	Location	Both Sides	Both Sides	ACC
4. Component Mark	Material Type	TAIYO/ IJR-4000 MW300	IJR-4000 MW300	ACC
	Color	White	White	ACC
	Location	C/S, S/S	C/S, S/S	ACC
5. Peelable Solder Mask	Material Type
	Thickness
	Location
6. Identification	UL Mark	YES	YES	ACC
	Date Code	WWYY	0421	ACC
	Mark Location	Solder Side	Solder Side	ACC
7. Surface Finish	Method	Immersion Gold	Immersion Gold	ACC
	Tin Thickness
	Nickel Thickness	3-6µm	5.27µm	ACC
	Gold Thickness	0.05µm	0.065µm	ACC
8. Normativeness	RoHS	Directive 2015/863/EU	OK	ACC
8. Normativeness	REACH	Directive 1907 /2006	OK	ACC
9.Annular Ring	Min. Line Width (mil)	6mil	5.8mil	ACC
9.Annular Ring	Min. Spacing (mil)	5mil	5.2mil	ACC
10.V-groove	Angle	30±5º	30º	ACC
10.V-groove	Residual thickness	0.4±0.1mm	0.39mm	ACC
11. Beveling	Angle
11. Beveling	Height
12. Function	Electrical Test	100% PASS	100% PASS	ACC
13. Appearance	IPC Class Level	IPC-A-600J &6012D Class 2	IPC-A-600J &6012D Class 2	ACC
	Visual Inspection	IPC-A-600J &6012D Class 2	IPC-A-600J &6012D Class 2	ACC
	Warp and Twist	≦0.7%	0.32%	ACC
14. Reliability Test	Tape Test	No Peeling	OK	ACC
	Solvent Test	No Peeling	OK	ACC
	Solderability Test	265 ±5℃	OK	ACC
	Thermal Stress Test	288 ±5℃	OK	ACC
	Ionic Contamination Test	≦ 1.56 µg/c㎡	0.58µg/c㎡	ACC

Our Advantages

ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

16000㎡ workshop;

30000㎡ output capability per month;

Prototype to large volume production capability

IPC Class 2 / IPC Class 3;

Any layer HDI PCBs;

Delivery on time: >98%

Customer complaint rate: <1%

Our PCB Capability (2022)

Parameter	Value
Layer Counts	1-32
Substrate Material	RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
Maximum Size	Flying test: 900600mm, Fixture test 460380mm, No test 1100*600mm
Board Outline Tolerance	±0.0059" (0.15mm)
PCB Thickness	0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)	±8%
Thickness Tolerance(t＜0.8mm)	±10%
Insulation Layer Thickness	0.00295" - 0.1969" (0.075mm--5.00mm)
Minimum Track	0.003" (0.075mm)
Minimum Space	0.003" (0.075mm)
Outer Copper Thickness	35µm--420µm (1oz-12oz)
Inner Copper Thickness	17µm--350µm (0.5oz - 10oz)
Drill Hole(Mechanical)	0.0059" - 0.25" (0.15mm--6.35mm)
Finished Hole(Mechanical)	0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical)	0.00295" (0.075mm)
Registration (Mechanical)	0.00197" (0.05mm)
Aspect Ratio	12:1
Solder Mask Type	LPI
Min Soldermask Bridge	0.00315" (0.08mm)
Min Soldermask Clearance	0.00197" (0.05mm)
Plug via Diameter	0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance	±10%
Surface Finish	HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold and Green Solder Mask for Industrial Servers

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