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High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance

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Shenzhen Bicheng Electronics Technology Co., Ltd

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High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance

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Brand Name :	Bicheng Technologies Limited
Model Number :	BIC-506-V0.81
Certification :	UL
Price :	USD 2.99-9.99 PER PIECE
Payment Terms :	T/T, Western Union
Supply Ability :	45000 pieces per month
Delivery Time :	10 working days

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High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance

High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

IT-180ATC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for various applications and can pass 260℃ lead free assembly. Thickness ranges 0.5mm to 3.2mm, copper weight 0.5oz to 3oz.

Applications

Automotive (Engine room ECU)

Multilayer and HDI PCB

Backplanes

Data Storage

Server and Networking

Telecommunications

Heavy Copper

Key Features

Low CTE

High heat resistance

Excellent CAF resistance

Good through-hole reliability

Our PCB Capability (IT-180ATC)

PCB Material:	High Tg, Lead Free High Reliability Epoxy Resin
Designation:	IT-180ATC
Dielectric constant:	4.4 at 1GHz
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness:	0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology:	HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

Appendix: General Properties of IT-180ATC

Items	IPC TM-650	Typical Value	Unit
Peel Strength, minimum	2.4.8		lb/inch
A. Low profile copper foil		5
B. Standard profile copper foil		8
Volume Resistivity	2.5.17.1	1x109	M-cm
Surface Resistivity	2.5.17.1	1x108	M
Moisture Absorption, maximum	2.6.2.1	0.1	%
Permittivity (Dk, 50% resin content)			--
A. 1MHz	2.5.5.9	4.5
B. 1GHz	2.5.5.9	4.4
Loss Tangent (Df, 50% resin content)			--
A. 1MHz	2.5.5.9	0.014
B. 1GHz	2.5.5.9	0.015
Flexural Strength, minimum			N/mm2
A. Length direction	2.4.4	500-530
B. Cross direction		410-440
Thermal Stress 10 s at 288°C
A. Unetched	2.4.13.1	Pass	Rating
B. Etched		Pass
Flammability	UL94	V-0	Rating
Comparative Tracking Index (CTI)	IEC 60112 / UL 746	CTI 3 (175-249)	Class (Volts)
Glass Transition Temperature(DSC)	2.4.25	175	˚C
Decomposition Temperature	2.4.24.6	345	˚C
X/Y Axis CTE (40℃ to 125℃)	2.4.41	11-13 / 13-15	ppm/˚C
Z-Axis CTE
A. Alpha 1		45	ppm/˚C
B. Alpha 2	2.4.24	210	ppm/˚C
C. 50 to 260 Degrees C		2.7	%
Thermal Resistance
A. T260	2.4.24.1	>60	Minutes

High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance

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