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TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50

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Shenzhen Bicheng Electronics Technology Co., Ltd

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TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50

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Brand Name :	Bicheng Technologies Limited
Model Number :	BIC-509-V3.5
Certification :	UL
Price :	USD 9.99-99.99 per piece
Payment Terms :	T/T, Paypal
Supply Ability :	45000 pieces per month
Delivery Time :	10 working days

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Product Details
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TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50

TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50 OHM
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction
This is a type of low loss high performance multi-layer PCB built on TUC’s TU-883 core with 20 copper layers (20-layer PCB). It’s also a type of HDI circuit boards (N+1+N) with 0.1mm laser drill. This is also a type of impedance controlled PCB, 90 Ohms and 50 Ohms are controlled on each signal layers with 10% tolerance. The copper foils are 1 oz and half oz used alternately between layers. The whole PCB is 3.0mm thick, with immersion gold on pads, green solder mask and white silkscreen.

Applications
Radio frequency
Backplane, High performance computing
Line cards, Storage
Servers, Telecom, Base station, Office Routers

Detailed Specifications

Item	Description	Actual	Result
1. Laminate	Material Type	TU-883	ACC
	Tg	170℃	ACC
	Supplier	TUC	ACC
	Thickness	2.8-3.1mm	ACC
2.Plating thickness	Hole Wall	26.51µm	ACC
	Outer copper	41.09µm	ACC
	Inner Copper	15µm / 31µm	ACC
3.Solder mask	Material Type	TAIYO/ PSR-2000GT600D	ACC
	Color	Green	ACC
	Rigidity (Pencil Test)	5H	ACC
	S/M Thickness	20.11µm	ACC
	Location	Both Sides	ACC
4. Component Mark	Material Type	IJR-4000 MW300	ACC
	Color	White	ACC
	Location	C/S, S/S	ACC
5. Peelable Solder Mask	Material Type	/
	Thickness	/
	Location	/
6. Identification	UL Mark	YES	ACC
	Date Code	2921	ACC
	Mark Location	Solder Side	ACC
7. Surface Finish	Method	Immersion Gold	ACC
	Nickel Thickness	4.06µm	ACC
	Gold Thickness	0.056µm	ACC
8. Normativeness	RoHS	Directive 2015/863/EU	ACC
8. Normativeness	REACH	Directive 1907 /2006	ACC
9.Annular Ring	Min. Line Width (mil)	4.8mil	ACC
9.Annular Ring	Min. Spacing (mil)	5.2mil	ACC
10.V-groove	Angle	/
10.V-groove	Residual thickness	/
11. Beveling	Angle	/
11. Beveling	Height	/
12. Function	Electrical Test	100% PASS	ACC
13. Appearance	IPC Class Level	IPC-A-600J &6012D Class 2	ACC
	Visual Inspection	IPC-A-600J &6012D Class 2	ACC
	Warp and Twist	0.21%	ACC
14. Reliability Test	Tape Test	No Peeling	ACC
	Solvent Test	No Peeling	ACC
	Solderability Test	265 ±5℃	ACC
	Thermal Stress Test	288 ±5℃	ACC
	Ionic Contamination Test	0.56µg/c㎡	ACC

Stackup & Impedance Controlled

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TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50

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