Hello Everyone,
Today, we’re going to introduce high frequency PCB built on RO4350B
laminates.
RO4350B is a woven glass cloth reinforced hydrocarbon resin
ceramic-filled laminate from Rogers Corporation, which has very
similar electrical properties to PTFE/fabric glass cloth material
and its processability is similar to epoxy resin/glass cloth
material.
The Reason for using RO4350B Laminates
1. Superior high frequency performance
RO4350B materials are hydrocarbon ceramic filled laminates, not
PTFE which are designed to offer superior high frequency
performance.
2. Low dielectric loss
Low loss results in excellent electrical performance and allows
applications with high operating frequencies.
3. Stable electrical properties versus frequency
RO4350B material possesses the properties of RF microwave circuits,
matching networks and controlled impedance transmission lines.
4. Low thermal coefficient of dielectric constant
This allows the RO4350B to exhibit excellent dimensional stability,
a property needed for mixed dielectric multi-layer PCBs
constructions and reliable plated through holes.
5. Cost
RO4350B laminates can be fabricated using standard FR-4 processes,
do not require speicalized via preparation prcoesses, can be
processed by automated handling systems and scrubbing equipment
used for copper surface preparation. This properties allow it can
be using in volume manufacturing and get competitively priced.
PCB Capability
Double sided circuit boards on RO4350B are available in a variety
of thicknesses, such as 10mil, 20mil, 30mil and 60mil. It's used in
a variety of typical and non-traditional microwave / radio
frequency applications, such as base station antennas, attenuator,
power amplifiers, RFID, radar and sensors etc.
| PCB Material: | Glass reinforced hydrocarbon ceramic laminates |
| Code: | Rogers RO4350B |
| Dielectric constant: | 3.48 ±0.05 (process) |
| 3.65 (design) |
| Layer count: | 1 Layer, 2 Layer, Multilayer, Hybrid type (Mixed) |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm) |
| 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Silver, OSP,etc. |
Multilayer PCB
The multilayer PCB of RO4350B is mostly four-layer, six-layer and
eight-layer, and some are designed as three-layer (false
four-layer), five-layer (false six-layer) and so on.
Hybrid PCB
In order to save production cost without reducing signal loss in
high frequency environment, FR-4 glass fiber material is mixed with
RO4350B in multi-layer circuit board. The high frequency material
is used in signal layer and FR-4 glass fiber material is used in
other layers.
RO4350B PCB
The basic colour of RO4350B PCB is white.
We specialize in provide you with prototype, small batches and mass
production service.
If you have any requirements on this kind of PCB, please feel free
to contact us.
Thank you for your reading.
Appendix: Typical Properties of RO4350B
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.66 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0037
0.0031 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 5.7 x109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432)
14,153(2,053) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5)
130(18.9) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255
(37) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.5 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10
12
32 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 390 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.69 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.86 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 0.88
(5.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | (3)V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
