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Rogers 50mil 1.27mm TMM10 High Frequency PCBs with Immersion Gold for GPS Antennas

Shenzhen Bicheng Electronics Technology Co., Ltd
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    Buy cheap Rogers 50mil 1.27mm TMM10 High Frequency PCBs with Immersion Gold for GPS Antennas from wholesalers
     
    Buy cheap Rogers 50mil 1.27mm TMM10 High Frequency PCBs with Immersion Gold for GPS Antennas from wholesalers
    • Buy cheap Rogers 50mil 1.27mm TMM10 High Frequency PCBs with Immersion Gold for GPS Antennas from wholesalers
    • Buy cheap Rogers 50mil 1.27mm TMM10 High Frequency PCBs with Immersion Gold for GPS Antennas from wholesalers

    Rogers 50mil 1.27mm TMM10 High Frequency PCBs with Immersion Gold for GPS Antennas

    Ask Lasest Price
    Brand Name : Bicheng Technologies Limited
    Model Number : BIC-151-V0.37
    Certification : UL
    Price : USD 9.99-99.99
    Payment Terms : T/T, Western Union
    Supply Ability : 50000 pieces per month
    Delivery Time : 10 working days
    • Product Details
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    Rogers 50mil 1.27mm TMM10 High Frequency PCBs with Immersion Gold for GPS Antennas

    Rogers 50mil 1.27mm TMM10 High Frequency PCBs with Immersion Gold for GPS Antennas

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    Rogers’ TMM10 thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications.


    The electrical and mechanical properties of TMM10 laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials.


    TMM10 laminates have an exceptionally low thermal coefficient of dielectric constant, typically less than 30 ppm/°C. The material’s isotropic coefficients of thermal expansion, very closely matched to copper, allow for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM10 laminates is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.


    TMM10 laminates are based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.


    Some Typical Applications:

    1. Chip testers

    2. Dielectric polarizers and lenses

    3. Filters and coupler

    4. Global Positioning Systems Antennas

    5. Patch Antennas

    6. Power amplifiers and combiners

    7. RF and microwave circuitry

    8. Satellite communication systems


    Our Capabilities (TMM10)

    PCB Material:Ceramic, Hydrocarbon, Thermoset Polymer Composites
    Designation:TMM10
    Dielectric constant:9.20 ±0.23
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP etc..

    Data Sheet of TMM10

    TMM10 Typical Value
    PropertyTMM10DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess9.20±0.23Z10 GHzIPC-TM-650 2.5.5.5
    Dielectric Constant,εDesign9.8--8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor (process)0.0022Z-10 GHzIPC-TM-650 2.5.5.5
    Thermal Coefficient of dielectric constant-38-ppm/°K-55-125IPC-TM-650 2.5.5.5
    Insulation Resistance>2000-GohmC/96/60/95ASTM D257
    Volume Resistivity2 x 108-Mohm.cm-ASTM D257
    Surface Resistivity4 x 107-Mohm-ASTM D257
    Electrical Strength(dielectric strength)285ZV/mil-IPC-TM-650 method 2.5.6.2
    Thermal Properties
    Decompositioin Temperature(Td)425425TGA-ASTM D3850
    Coefficient of Thermal Expansion - x21Xppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
    Coefficient of Thermal Expansion - Y21Yppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
    Coefficient of Thermal Expansion - Z20Zppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
    Thermal Conductivity0.76ZW/m/K80 ASTM C518
    Mechanical Properties
    Copper Peel Strength after Thermal Stress5.0 (0.9)X,Ylb/inch (N/mm)after solder float 1 oz. EDCIPC-TM-650 Method 2.4.8
    Flexural Strength (MD/CMD)13.62X,YkpsiAASTM D790
    Flexural Modulus (MD/CMD)1.79X,YMpsiAASTM D790
    Physical Properties
    Moisture Absorption (2X2)1.27mm (0.050")0.09-%D/24/23ASTM D570
    3.18mm (0.125")0.2
    Specific Gravity2.77--AASTM D792
    Specific Heat Capacity0.74-J/g/KACalculated
    Lead-Free Process CompatibleYES----



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