Rogers 50mil 1.27mm TMM10 High Frequency PCBs with Immersion Gold
for GPS Antennas
(Printed Circuit Boards are custom-made products, the picture and
parameters shown are just for reference)
Rogers’ TMM10 thermoset microwave materials are ceramic,
hydrocarbon, thermoset polymer composites designed for high
plated-thru-hole reliability stripline and microstrip applications.
The electrical and mechanical properties of TMM10 laminates combine
many of the benefits of both ceramic and traditional PTFE microwave
circuit laminates, without requiring the specialized production
techniques common to these materials.
TMM10 laminates have an exceptionally low thermal coefficient of
dielectric constant, typically less than 30 ppm/°C. The material’s
isotropic coefficients of thermal expansion, very closely matched
to copper, allow for production of high reliability plated through
holes, and low etch shrinkage values. Furthermore, the thermal
conductivity of TMM10 laminates is approximately twice that of
traditional PTFE/ceramic laminates, facilitating heat removal.
TMM10 laminates are based on thermoset resins, and do not soften
when heated. As a result, wire bonding of component leads to
circuit traces can be performed without concerns of pad lifting or
substrate deformation.
Some Typical Applications:
1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems
Our Capabilities (TMM10)
| PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Designation: | TMM10 |
| Dielectric constant: | 9.20 ±0.23 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm),
50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm),
125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil
(6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm) |
|
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Data Sheet of TMM10
| TMM10 Typical Value |
| Property | | TMM10 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 9.20±0.23 | Z | | 10 GHz | IPC-TM-650 2.5.5.5 |
| Dielectric Constant,εDesign | 9.8 | - | - | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor (process) | 0.0022 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of dielectric constant | -38 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 |
| Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 |
| Volume Resistivity | 2 x 108 | - | Mohm.cm | - | ASTM D257 |
| Surface Resistivity | 4 x 107 | - | Mohm | - | ASTM D257 |
| Electrical Strength(dielectric strength) | 285 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 |
| Thermal Properties |
| Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 |
| Coefficient of Thermal Expansion - x | 21 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
| Coefficient of Thermal Expansion - Y | 21 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
| Coefficient of Thermal Expansion - Z | 20 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
| Thermal Conductivity | 0.76 | Z | W/m/K | 80 ℃ | ASTM C518 |
| Mechanical Properties |
| Copper Peel Strength after Thermal Stress | 5.0 (0.9) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 |
| Flexural Strength (MD/CMD) | 13.62 | X,Y | kpsi | A | ASTM D790 |
| Flexural Modulus (MD/CMD) | 1.79 | X,Y | Mpsi | A | ASTM D790 |
| Physical Properties |
| Moisture Absorption (2X2) | 1.27mm (0.050") | 0.09 | - | % | D/24/23 | ASTM D570 |
| 3.18mm (0.125") | 0.2 |
| Specific Gravity | 2.77 | - | - | A | ASTM D792 |
| Specific Heat Capacity | 0.74 | - | J/g/K | A | Calculated |
| Lead-Free Process Compatible | YES | - | - | - | - |
