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RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

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10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions

Shenzhen Bicheng Electronics Technology Co., Ltd
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    Buy cheap 10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions from wholesalers
     
    Buy cheap 10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions from wholesalers
    • Buy cheap 10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions from wholesalers
    • Buy cheap 10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions from wholesalers

    10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions

    Ask Lasest Price
    Brand Name : Bicheng Technologies Limited
    Model Number : BIC-0071-V4.1
    Certification : UL
    Price : USD 2.99-5.99 per piece
    Payment Terms : T/T, Paypal
    Supply Ability : 45000 pieces per month
    Delivery Time : 6-7 working days
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    10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions

    10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions
    (PCB's are custom-made products, the picture and parameters shown are just for reference)

    Hello everyone,
    Good day!
    In the previous products, we’ve talked 4-layer RF PCB and 6-layer RF PCB. We have known that Rogers multilayer PCBs are made of every different core. So 10-layer RF PCB becomes simple now, is it right?

    10-layer RF PCB is made on 5 cores of Rogers material. Since the final thickness will not be much thicker, so the thin core is usually used, such as 6.6mil RO4350B, 10mil RO4350B, 13.3mil RO4350B, 8mil RO4003C and12mil RO4003C etc.

    Today this 10-layer PCB is on 5 cores of 10mil RO4350B combined by RO4450F prepreg.
    It’s for the application of broadband wireless solutions. It's 2.0 mm thick, pads are immersion gold plated. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards are packed for shipment.

    Features and benefits
    1) Excellent dimensional stability.
    2) Good high temperature and low temperature resistance.(-192℃-260℃)
    3) Immersion gold has excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
    4) Engineering design prevents problems from occurring in preproduction.
    5) DDU Door to door shipment with competitive shipping cost,
    6) No MOQ, low cost for prototypes and samples.

    Applications
    RF transceiver, Communications relays, Low Noise Block, Splitter module

    Parameter and data sheet

    PCB SIZE115 x 110mm=1PCS=1design
    BOARD TYPEHigh Frequency PCB, Multilayer PCB
    Number of Layers10 layers
    Surface Mount ComponentsYES
    Through Hole ComponentsNO
    LAYER STACKUPTOP Layer: signal - 1/2oz foil + 25μm Cu
    Core RO4350B -0.254mm
    INT 1: mixed - 1/2oz foil
    Prepreg RO4450F -0.202mm (2 x 0.101)
    INT 2: mixed - 1/2oz foil
    Core RO4350B -0.254mm
    INT 3: mixed - 1/2oz foil
    Prepreg RO4450F -0.202mm (2 x 0.101)
    INT 4: mixed - 1/2oz foil
    Core RO4350B -0.254mm
    INT 5: mixed - 1/2oz foil
    Prepreg RO4450F -0.202mm (2 x 0.101)
    INT 6: mixed - 1/2oz foil
    Core RO4350B -0.254mm
    INT 7: mixed - 1/2oz foil
    Prepreg RO4450F -0.202mm (2 x 0.101)
    INT 8: mixed - 1/2oz foil
    Core RO4350B -0.254mm
    BOT Layer: signal - 1/2oz foil + 25μm Cu
    TECHNOLOGY
    Minimum Trace and Space:5.5mil/5mil
    Minimum / Maximum Holes:0.3/2.0mm
    Number of Different Holes:9
    Number of Drill Holes:7505
    Number of Milled Slots:0
    Number of Internal Cutouts:0
    Impedance ControlNO
    BOARD MATERIAL
    Glass Epoxy:RO4350B core 0.254mm(10mil), RO4450B PP 0.1mm(4mil)
    Final foil external:1oz
    Final foil internal:0.5oz
    Final height of PCB:2.0mm ±10%
    PLATING AND COATING
    Surface FinishElectroless nickel over Immersion Gold (ENIG)( 0.05µm over 3µm nickel)
    Solder Mask Apply To:N/A
    Solder Mask Color:N/A
    Solder Mask Type:N/A
    CONTOUR/CUTTINGRouting
    MARKING
    Side of Component LegendN/A
    Colour of Component LegendN/A
    Manufacturer Name or Logo:N/A
    VIAPlated Through Hole(PTH), via tented. BGA package
    FLAMIBILITY RATINGUL 94-V0 Approval MIN.
    DIMENSION TOLERANCE
    Outline dimension:0.0059" (0.15mm)
    Board plating:0.0030" (0.076mm)
    Drill tolerance:0.002" (0.05mm)
    TEST100% Electrical Test prior shipment
    TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
    SERVICE AREAWorldwide, Globally.























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