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Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

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High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4

Shenzhen Bicheng Electronics Technology Co., Ltd
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    Buy cheap High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4 from wholesalers
     
    Buy cheap High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4 from wholesalers
    • Buy cheap High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4 from wholesalers
    • Buy cheap High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4 from wholesalers

    High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4

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    Brand Name : Bicheng Technologies Limited
    Model Number : BIC-0075-V5.4
    Certification : UL
    Price : USD2.99-8.99 Per Piece
    Payment Terms : T/T, Paypal
    Supply Ability : 45000 pieces per month
    Delivery Time : 5-6 working days
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    High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4

    High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4

    (PCB’s are custom-made products, the picture and parameters shown are just for reference)


    Hi Everyone,

    Today, we’re going to talk about 4-layer high frequency PCB made on 12mil RO4003C and FR-4 combined.


    The board is designed as a 4-layer structure, because 4-layer PCB is relatively simple and inexpensive, which is helpful to open up a new market.


    Let’s see today’s first board.



    Viewing from stack up, we can see the 1st layer to the 2nd layer and 4th layer to 3rd layer are 12mil core of RO4003C, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the rest are FR-4 materials. Copper weight on inner layer and outer layer is 1 ounce.


    The 2nd board FR-4 is moved to layer 3 and layer 4. According to the actual applications, the thickness of dielectric material and FR-4 can be adjusted.



    The applications of 12mil RO4003C hybrid PCB is wide, such as Modular oscilloscope, antenna combiner, balanced amplifier, 4G antenna etc.


    The advantages of 12mil RO4003C hybrid PCB are reflected in following 3 points:

    1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.

    2) Reducing signal loss in high frequency application meets the development needs of communication technology.

    3) Cost reduced over stack-ups with all low loss material;



    At present, the mature mixed pressing materials are as follows:

    RO4350B + FR4;

    RO4003C + FR4;

    F4B + FR4;

    RT/duroid 5880 + RO4350B

    RT/duroid 5880 + FR4


    Our PCB Capability (Hybrid Design)

    PCB Type:Hybrid PCB, Mixed PCB
    Mixed type:RO4350B + FR4;
    RO4003C + FR4;
    F4B + FR4;
    Duroid/RT5880 + RO4350B
    Duroid/RT5880 + FR4
    Solder mask:Green, Red, Blue, Black, Yellow
    Layer count:4 Layer, 6 Layer, Multilayer
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:1.0-5.0mm
    PCB size:400mm X 500mm
    Surface finish:Bare copper, HASL, ENIG, Immersion tin, OSP

    At the same time, we are able to supply blind via board, buried via board and HDI board. All the PCB's of our company will go through AOI test, open and short circuit test, solderability test and 288 ℃ thermal stress test to ensure high quality PCB shipped to your hands.


    Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.

    Appendix: Data Sheet of RO4003C
    RO4003C Typical Value
    PropertyRO4003CDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.38±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.55Z8 to 40 GHzDifferential Phase Length Method
    Dissipation Factortan,δ0.0027
    0.0021
    Z10 GHz/23℃
    2.5 GHz/23℃
    IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε+40Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
    Volume Resistivity1.7 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity4.2 x 109COND AIPC-TM-650 2.5.17.1
    Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
    Tensile Modulus19,650(2,850)
    19,450(2,821)
    X
    Y
    MPa(ksi)RTASTM D 638
    Tensile Strength139(20.2)
    100(14.5)
    X
    Y
    MPa(ksi)RTASTM D 638
    Flexural Strength276
    (40)
    MPa
    (kpsi)
    IPC-TM-650 2.4.4
    Dimensional Stability<0.3X,Ymm/m
    (mil/inch)
    after etch+E2/150℃IPC-TM-650 2.4.39A
    Coefficient of Thermal Expansion11
    14
    46
    X
    Y
    Z
    ppm/℃-55℃to288℃IPC-TM-650 2.4.41
    Tg>280℃ TMAAIPC-TM-650 2.4.24.3
    Td425℃ TGAASTM D 3850
    Thermal Conductivity0.71W/M/oK80℃ASTM C518
    Moisture Absorption0.06%48hrs immersion 0.060"
    sample Temperature 50℃
    ASTM D 570
    Density1.79gm/cm323℃ASTM D 792
    Copper Peel Stength1.05
    (6.0)
    N/mm
    (pli)
    after solder float 1 oz.
    EDC Foil
    IPC-TM-650 2.4.8
    FlammabilityN/AUL 94
    Lead-free Process CompatibleYes
    Quality High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4 for sale
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