Hello Everyone,
Today, we introduce high frequency PCB built on RT/duroid 5870
laminates.
RT/duroid 5870 is glass microfiber reinforced PTFE composite of
Rogers Corporation, which is designed for exacting stripline and
microstrip circuit applications.
Let's see the reasons for using RT/duroid 5870 material.
1) The randomly oriented microfibers result in exceptional
dielectric constant uniformity.
2) The dielectric constant of RT/duroid 5870 laminates is uniform
from panel to panel and is constant over a wide frequency range.
3) Its low dissipation factor extends the usefulness of RT/duroid
5870 laminates to Ku-band and above.
4) Designed for microstrip and stripline application
PCB Capability (RT/duroid 5870)
| PCB Material: | Glass microfiber reinforced PTFE composites |
| Designator: | RT/duroid 5870 |
| Dielectric constant: | 2.33 ±0.02 (process) |
| 2.33 (design) |
| Layer count: | 1 Layer, 2 Layer, Multilayer, Hybrid type (Mixed) |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm) |
| 31mil (0.787mm), 62mil (1.575mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, OSP. |
| | |
RT/duroid 5870 is often used in double sided PCB, multilayer PCB
and hybrid PCB.It's available in a variety of thicknesses for
double sided PCB, such as 10mil, 20mil, 31mil and 62mil. Surface
finishes are bare copper, HASL, ENIG, Immersion tine and OSP for
option.
The typical applications are microstrip and stripline circuits,
commercial airline broadband antenna,radar systems, millimeter wave
applications, point to point digital radio antenna etc.
The basic colour of RT/duroid 5870 PCB is black.
We specialize in providing you with prototype, small batches and
mass production service. If you have any questions, please feel
free to contact us.
Thank you for your reading.
Appendix: Typical Value of RT/duroid 5870
| Property | RT/duroid 5870 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 2.33
2.33±0.02 spec. | Z | N/A | C24/23/50
C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
| Dielectric Constant,εDesign | 2.33 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0005
0.0012 | Z | N/A | C24/23/50
C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
| Thermal Coefficient of ε | -115 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 |
| Specific Heat | 0.96(0.23) | N/A | j/g/k
(cal/g/c) | N/A | Calculated |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1300(189) | 490(71) | X |
| 1280(185) | 430(63) | Y |
| Ultimate Stress | 50(7.3) | 34(4.8) | X |
| 42(6.1) | 34(4.8) | Y |
| Ultimate Strain | 9.8 | 8.7 | X | % |
| 9.8 | 8.6 | Y |
| Compressive Modulus | 1210(176) | 680(99) | X | MPa(kpsi) | A | ASTM D 695 |
| 1360(198) | 860(125) | Y |
| 803(120) | 520(76) | Z |
| Ultimate Stress | 30(4.4) | 23(3.4) | X |
| 37(5.3) | 25(3.7) | Y |
| 54(7.8) | 37(5.3) | Z |
| Ultimate Strain | 4 | 4.3 | X | % |
| 3.3 | 3.3 | Y |
| 8.7 | 8.5 | Z |
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 |
| Thermal Conductivity | 0.22 | Z | W/m/k | 80℃ | ASTM C 518 |
| Coefficient of Thermal Expansion | 22
28
173 | X
Y
Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 |
| Copper Peel | 27.2(4.8) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil
after solder float | IPC-TM-650 2.4.8 |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A |
