Sign In | Join Free | My himfr.com
himfr.com

Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

Site Member

9 Years

Home > Hybrid PCB Board >

Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

Shenzhen Bicheng Electronics Technology Co., Ltd
Contact Now
    Buy cheap Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 from wholesalers
     
    Buy cheap Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 from wholesalers
    • Buy cheap Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 from wholesalers
    • Buy cheap Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 from wholesalers
    • Buy cheap Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 from wholesalers
    • Buy cheap Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 from wholesalers

    Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

    Ask Lasest Price
    Brand Name : Bicheng Technologies Limited
    Model Number : BIC-76-V1.24
    Certification : UL
    Price : USD 9.99-99.99
    Payment Terms : T/T
    Supply Ability : 50000 pieces per month
    Delivery Time : 10 working days
    • Product Details
    • Company Profile

    Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4


    Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

    (PCB’s are custom-made products, the picture and parameters shown are just for reference)


    Hello everyone,

    Warm greetings!


    Today we talk about 4-layer hybrid PCB built on 20mil RO4003C and FR-4.


    Firstly, it's a 4 layer structure. Layer 1 to layer 2 is 20mil RO4003C core, which is the main wiring layer for the signal lines. Layer 3 to layer 4 is the core of FR-4, both cores are combined through 0.2mm prepeg. Each layer is connected by plated through holes. The inner layer and out layer of copper is 1 ounce. This is a good method to keep the board cost effective.


    Let's take a look at its micro-section chart.

    Here on the left is the PTH hole, the bottom is layer 1 to layer 2 which is high frequency material, the upper part is glass fiber material. The finished thickness of the plate is 1.6mm.

    The color of solder mask and silkscreen are also commonly used in green and white. Surface finish on pads is immersion gold.


    Following is another type of 20mil RO4003C hybrid PCB. It’s made of 2 cores of 20mil RO4003C.


    The applications of 20mil RO4003C hybrid PCB is wide, such as LNA, optical coupler, balanced amplifier, duplexer etc.


    The advantages of 20mil RO4003C hybrid PCB are reflected in following 3 points:

    1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.

    2) Reducing signal loss in high frequency application meets the development needs of communication technology.

    3) Cost reduced over stack-ups with all low loss material;


    Our PCB Capability (Hybrid Design)


    At present, the mature mixed pressing materials are as follows:

    RO4350B + FR4;

    RO4003C + FR4;

    F4B + FR4;

    RT/duroid5880 + FR4

    RT/duroid5880 + RO4350B


    Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.


    Appendix: Data Sheet of RO4003C


    PropertyRO4003CDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.38±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.55Z8 to 40 GHzDifferential Phase Length Method
    Dissipation Factortan,δ0.0027
    0.0021
    Z10 GHz/23℃
    2.5 GHz/23℃
    IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε+40Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
    Volume Resistivity1.7 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity4.2 x 109COND AIPC-TM-650 2.5.17.1
    Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
    Tensile Modulus19,650(2,850)
    19,450(2,821)
    X
    Y
    MPa(ksi)RTASTM D 638
    Tensile Strength139(20.2)
    100(14.5)
    X
    Y
    MPa(ksi)RTASTM D 638
    Flexural Strength276
    (40)
    MPa
    (kpsi)
    IPC-TM-650 2.4.4
    Dimensional Stability<0.3X,Ymm/m
    (mil/inch)
    after etch+E2/150℃IPC-TM-650 2.4.39A
    Coefficient of Thermal Expansion11
    14
    46
    X
    Y
    Z
    ppm/℃-55℃to288℃IPC-TM-650 2.4.41
    Tg>280℃ TMAAIPC-TM-650 2.4.24.3
    Td425℃ TGAASTM D 3850
    Thermal Conductivity0.71W/M/oK80℃ASTM C518
    Moisture Absorption0.06%48hrs immersion 0.060"
    sample Temperature 50℃
    ASTM D 570
    Density1.79gm/cm323℃ASTM D 792
    Copper Peel Stength1.05
    (6.0)
    N/mm
    (pli)
    after solder float 1 oz.
    EDC Foil
    IPC-TM-650 2.4.8
    FlammabilityN/AUL 94
    Lead-free Process CompatibleYes
    Quality Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Shenzhen Bicheng Electronics Technology Co., Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)