Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4
(PCB’s are custom-made products, the picture and parameters shown
are just for reference)
Hello everyone,
Warm greetings!
Today we talk about 4-layer hybrid PCB built on 20mil RO4003C and
FR-4.
Firstly, it's a 4 layer structure. Layer 1 to layer 2 is 20mil
RO4003C core, which is the main wiring layer for the signal lines.
Layer 3 to layer 4 is the core of FR-4, both cores are combined
through 0.2mm prepeg. Each layer is connected by plated through
holes. The inner layer and out layer of copper is 1 ounce. This is
a good method to keep the board cost effective.
Let's take a look at its micro-section chart.
Here on the left is the PTH hole, the bottom is layer 1 to layer 2
which is high frequency material, the upper part is glass fiber
material. The finished thickness of the plate is 1.6mm.
The color of solder mask and silkscreen are also commonly used in
green and white. Surface finish on pads is immersion gold.
Following is another type of 20mil RO4003C hybrid PCB. It’s made of
2 cores of 20mil RO4003C.
The applications of 20mil RO4003C hybrid PCB is wide, such as LNA,
optical coupler, balanced amplifier, duplexer etc.
The advantages of 20mil RO4003C hybrid PCB are reflected in
following 3 points:
1) RO4003C exhibits a stable dielectric constant over a broad
frequency range. This makes it an ideal substrate for broadband
applications.
2) Reducing signal loss in high frequency application meets the
development needs of communication technology.
3) Cost reduced over stack-ups with all low loss material;
Our PCB Capability (Hybrid Design)
At present, the mature mixed pressing materials are as follows:
RO4350B + FR4;
RO4003C + FR4;
F4B + FR4;
RT/duroid5880 + FR4
RT/duroid5880 + RO4350B
Thank you for your reading. You’re welcome to contact us for your
RF PCB enquiries.
Appendix: Data Sheet of RO4003C
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.55 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0027
0.0021 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 4.2 x 109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850)
19,450(2,821) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2)
100(14.5) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276
(40) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.3 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11
14
46 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 425 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.71 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.79 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 1.05
(6.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | N/A | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
