Fast PCB Quick Turn Prototype 4-layer Circuit Board Built On FR-4 With 2oz and Immersion Gold
(Printed circuits boards are custom-made products, the picture and
parameters shown are just for reference)
1.1 General description
This is a type of fast lead time required multilayer PCB built on
FR-4 substrate with Tg 150°C for the application of Power Supply
Switch. It's standard 1.60 mm thick, white silkscreen over green
solder mask covers both sides. This is a power board, each layer
true 2oz applied and thicker gold 4 micro inches are plated on the
pads. The base material is used from ITEQ IT-158, entire board
supplying 1 up PCB. They're fabricated per IPC 6012 Class 2 using
supplied Gerber data. Each 25 panels are packed for shipment.
1.2 Features and benefits
1. Middle Tg PCB Shows outstanding thermal resistance and suitable
for lead-free process;
2. Very Low Moisture Absorption and better CAF resistance;
3. Gold has good oxidation resistance and good heat dissipation;
4. Gold has long storage time, it can be stored for more than 1
year in vacuum bag;
5. Competitive price and On-time service;
6. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
7. More than 18+ years of PCB experience;
8. Customer complaint rate: <1%
9. Door to door shipment service;
1.3 PCB Specifications
| PCB SIZE | 78 x 65mm=1PCS |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 4 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 70um(2oz)+plate TOP layer |
| Prepreg 7628 0.195mm |
| copper ------- 70um(2oz) MidLayer 1 |
| FR-4 0.2mm |
| copper ------- 70um(1oz) MidLayer 2 |
| Prepreg 7628 0.195mm |
| copper ------- 70um(2oz)+plate BOT layer |
| TECHNOLOGY | |
| Minimum Trace and Space: | 11.81 mil / 7.8 mil |
| Minimum / Maximum Holes: | 0.5 mm / 3.5 mm |
| Number of Different Holes: | 7 |
| Number of Drill Holes: | 125 |
| Number of Milled Slots: | NO |
| Number of Internal Cutouts: | NO |
| Impedance Control: | NO |
| Number of Gold finger: | NO |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4 Tg150℃, er<5.4.IT-158, ITEQ Supplied |
| Final foil external: | 2 oz |
| Final foil internal: | 2 oz |
| Final height of PCB: | 1.6 mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold (32.1% ) 0.1µm over 3µm nickel |
| Solder Mask Apply To: | TOP and Bottom, 14 micron Minimum |
| Solder Mask Color: | Green, PSR-2000GT600D, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo brand |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), minimum size 0.5 mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
1.4 Applications
Radar Detector
Multiplexer
Embedded System
Wireless Alarm
5G Booster
Peripheral Device
Mobile Modem
RF Amplifiers
Balanced Mixer
Relays (automotive and industrial)
1.5 Capability of Fast Delivery
| Types | Normal Lead time (≦1㎡) | Fast Lead Time (≦1㎡) |
| 2L | 5 Days | 1 Day |
| 4L | 5 Days | 2 Days |
| 6L | 6 Days | 3 Days |
| 8L | 7 Days | 4 Days |
| 10L | 9 Days | 6 Days |
| 12L | 10 Days | 6 Days |
| 14L | 13 Days | 7 Days |
| 16L | 14 Days | 7 Days |
| 18L | 15 Days | 9 Days |
| 20L | 16 Days | 10 Days |
| 22L | 17 Days | 11 Days |
| 24L | 18 Days | 12 Days |
| 26L | 19 Days | 13 Days |
| 28L | 20 Days | 14 Days |
| 30L | 21 Days | 15 Days |
| 32L | 22 Days | 16 Days |
| >32 Layers | Pending | Pending |
|
| Note: |
| 1.The lead time is for new order |
| 2.Exclude Sunday, holidays |
| 3.There's Order limitation every day. |
| 4.Exclude shipping time |
| 5.Exclude special technics, such as heavy copper, peelable mask,
blind/buried via etc. |
| 6.Exclude communications for engineering questions. |
