Multilayer Printed Circuit Board 8-Layer PCBs Built On Tg175℃ FR-4 With Immersion Gold
(Printed circuits boards are custom-made products, the picture and
parameters shown are just for reference)
1.1 General description
This is a type of 8-layer printed circuit board built on FR-4
Tg175℃ substrate for the application of Satellite Radio. It's 1.6
mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo)
and immersion gold on pads. The base material is from Taiwan ITEQ
supplying 1 up PCB per panel. They're fabricated per IPC 6012 Class
2 using supplied Gerber data. Each 25 panels are packed for
shipment.
1.2 Features and benefits
1. High Tg Materials are RoHS compliant and suitable for high
thermal reliability needs;
2. Immersin gold has high solderability, no stressing of circuit
boards and less contamination of PCB surface;
3. Delivery on time. Higher than 98% on-time-delivery rate;
4. 30000㎡ output capability per month;
5. More than 18 years of experience;
6. Powerful PCB capabilities support your research and development,
sales and marketing;
7. Any Layer HDI PCBs;
8. International approvals;
1.3 PCB Specifications
| PCB SIZE | 215 x 212mm=1PCS |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 8 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
| Prepreg 7628(43%) 0.195mm |
| copper ------- 35um(1oz) MidLayer 1 |
| FR-4 0.2mm |
| copper ------- 35um(1oz) MidLayer 2 |
| Prepreg 7628(43%) 0.195mm |
| copper ------- 35um(1oz) MidLayer 3 |
| FR-4 0.2mm |
| copper ------- 35um(1oz) MidLayer 4 |
| Prepreg 7628(43%) 0.195mm |
| copper ------- 35um(1oz) MidLayer 5 |
| FR-4 0.2mm |
| copper ------- 35um(1oz) MidLayer 6 |
| Prepreg 7628(43%) 0.195mm |
| copper ------- 18um(0.5oz)+plate BOT Layer |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4mil/4mil |
| Minimum / Maximum Holes: | 0.3/3.2mm |
| Number of Different Holes: | 18 |
| Number of Drill Holes: | 11584 |
| Number of Milled Slots: | 2 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4 TG170℃, er<5.4.IT-180, ITEQ Supplied |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold (32.1% ) 0.05µm over 3µm nickel |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000 KX700G, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing, stamp holes. |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | plated through hole(PTH), minimum size 0.3mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
1.4 Applications
WiFi Range Extender
CCTV System
Satellite Communication
5G Speed
Router WiFi 4G
Solar Panel Inverter
GPS Tracking Systems
Embedded Processor
PLC Programs
Phone systems
1.5 Glass Transition Temperature (Tg)
The thermal properties of the resin system are characterized by the
glass transition temperature (Tg), which always is expressed in °C.
The most commonly used property is the thermal expansion. When
measuring the expansion versus the temperature, we can get a curve
as shown in following picture. The Tg is determined by the
intersection of the tangents of the flat and steep parts of the
expansion curve. Below the glass transition temperature, the epoxy
resin is rigid and glassy. When the glass transition temperature is
exceeded, it changes to a soft and rubbery state.
For the most commonly used types of epoxy resin (FR-4 grade), the
glass transition temperature is in the range 115-130°C, so when the
board is soldered, the glass transition temperature is easily
exceeded. The board expands in the Z-axis direction and stresses
the copper of the hole wall. The expansion of epoxy resin is about
15 to 20 times greater than that of copper when exceeding Tg. This
implies a certain risk of wall cracking in plated-through holes,
and the more resin around the hole wall, the greater risk. Below
the glass transition temperature, the expansion ratio between epoxy
and copper is only three times, so here the risk of cracking is
negligible.
The Tg of general board is above 130 celsius degrees, high Tg is
generally greater than 170 celsius degrees, medium Tg is about
greater than 150 celsius degrees.PCB boards with Tg ≥ 170 ° C are
usually called high Tg PCBs.
1.6 Manufacturing Process of Multi-layer PTH PCB (via filled)
(1). Material Shearing
(2). Inner Layer Dry Film
(3). Inner Layer Etching
(4). AOI 1
(5). Black Oxidation
(6). Milling Outline Frame
(7). Inner Layer Drilling
(8). PTH 1
(9). Inner Layer Dry Film
(10). Pattern Plating 1
(11). Via filled
(12). Outer Layer Drilling
(13). PTH 2
(14). Pattern Plating 2
(15). Outer Layer Dry Film
(16). Copper-tin Electro-Plating
(17). Peeling and Etching
(18). AOI 2
(19). Solder Mask
(20). Silkscreen Printing
(21). Surface Finishing
(22). Electrical Testing
(23). Prolie Contouring
(24). FQC
(25). Packaging
(26). Delivery
