Rogers RO3206 High Frequency PCB DK 6.15 RF Circuits 25mil 50mil
0.635mm 1.27mm
(Printed Circuit Boards are custom-made products, the picture and
parameters shown are just for reference)
Introduction
RO3206 high frequency circuit materials are laminates that contain
ceramic fillers and are reinforced with woven fiberglass. These
materials have been specifically engineered to provide exceptional
electrical performance and mechanical stability while maintaining
competitive pricing. They are an extension of the RO3000 series
high frequency circuit materials, with the notable improvement of
enhanced mechanical stability.
With a dielectric constant of 6.15 and a low dissipation factor of
0.0027, RO3206 high frequency circuit materials offer an extended
useful frequency range beyond 40 GHz. This makes them suitable for
applications requiring high-frequency performance.
The RO3206 laminates combine the advantages of a non-woven PTFE
laminate, such as surface smoothness for finer line etching
tolerances, with the rigidity provided by a woven-glass PTFE
laminate. These materials can be easily fabricated into printed
circuit boards using standard PTFE circuit board processing
techniques.
To ensure consistent quality, RO3206 laminates are manufactured
under an ISO 9002 certified quality system. This certification
guarantees that the materials meet stringent quality standards and
adhere to established manufacturing practices.
Features and Benefits:
RO3206 offers the following features and benefits:
Woven glass reinforcement:
Enhances rigidity, facilitating easier handling during fabrication
and assembly processes.
Uniform electrical and mechanical performance:
Ideal for complex multi-layer high frequency structures, ensuring
consistent performance throughout the design.
Low dielectric loss:
Enables excellent high frequency performance by minimizing signal
loss and distortion.
Low in-plane expansion coefficient (matched to copper):
Compatible with epoxy multi-layer board hybrid designs, ensuring
reliable surface mounted assemblies.
Excellent dimensional stability:
Maintains consistent dimensions and shape during manufacturing
processes, leading to high production yields.
Cost-effective pricing:
Provides economical solutions for volume manufacturing, making it a
cost-efficient option for large-scale production.
Surface smoothness:
Features a smooth surface that allows for finer line etching
tolerances, enabling precise circuit design and fabrication.
Our PCB Capability (RO3206)
| PCB Capability (RO3206) |
| PCB Material: | Ceramic-filled Laminates Reinforced with Woven Fiberglass |
| Designation: | RO3206 |
| Dielectric constant: | 6.15 |
| Dissipation factor | 0.0027 |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 25mil (0.635mm), 50mil (1.27mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP,
Bare copper, Pure gold plated etc.. |
Typical Applications
RO3206 PCBs find application in various industries, including:
- Automotive collision avoidance systems
- Automotive global position satellite antennas
- Base station infrastructure
- Direct broadcast satellites
- Datalink on cable systems
- LMDS (Local Multipoint Distribution Service) and wireless broadband
- Microstrip patch antennas for wireless communications
- Remote meter readers
- Power backplanes
- Wireless telecommunications systems
RO3206 Data Sheet
| Typical Values |
| Property | RO3206 | Direction | Unit | Condtion | Test Method |
| Dielectric Constant, εr Process | 6.15± 0.15 | Z | - | 10 GHz 23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant, εr Design | 6.6 | Z | - | 8 GHz - 40 GHz | Differential Phase Length Method |
| Dissipation Factor, tan δ | 0.0027 | Z | - | 10 GHz 23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of εr | -212 | Z | ppm/°C | 10 GHz 0-100°C | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.8 | X,Y | mm/m | COND A | ASTM D257 |
| Volume Resistivity | 103 | | MΩ•cm | COND A | IPC 2.5.17.1 |
| Surface Resistivity | 103 | | MΩ | COND A | IPC 2.5.17.1 |
| Tensile Modulus | 462
462 | MD
CMD | kpsi | 23°C | ASTM D638 |
| Water Absorption | <0.1 | - | % | D24/23 | IPC-TM-650
2.6.2.1 |
| Specific Heat | 0.85 | | J/g/K | | Calculated |
| Thermal Conductivity | 0.67 | - | W/m/K | 80°C | ASTM C518 |
| Coefficient of Thermal Expansion (-55 to 288 °C) | 13
34 | X,Y,
Z | ppm/°C | 23°C/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | | °C | TGA | ASTM D3850 |
| Color | Tan | | | | |
| Density | 2.7 | | gm/cm3 | | |
| Copper Peel Strength | 10.7 | | pli | 1 oz. EDC After Solder Float | IPC-TM-2.4.8 |
| Flammability | V-0 | | | | UL 94 |
Lead Free Process
Compatible | YES | | | | |
