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Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask

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Shenzhen Bicheng Electronics Technology Co., Ltd

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Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask

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Brand Name :	Bicheng Technologies Limited
Model Number :	BIC-455-V9.96
Certification :	UL
Price :	USD 9.99-99.99
Payment Terms :	T/T / Paypal
Supply Ability :	45000 pieces per month
Delivery Time :	10 working days

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Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask

Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask

(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)

1.1 General description

This is a type of double sided circuit board built on FR-4 substrate with Tg 170°C for the application of keypad. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and hard gold on pads. The base material is from Shengyi supplying 1 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.

1.2 Features and benefits

1. Industrial standard material with high Tg (170℃ by DSC) and excellent thermal reliability;

2. Lead free assemblies with a maximum reflow temperature of 260℃;

3. SMT process is resistant to reflow soldering, resistant to rework;

4. Quick and on-time delivery;

5. ISO9001, ISO14001, UL certified manufacturing factory;

6. Competitive price;

7. No quality complaint is meant to save money;

8. Quick CADCAM checking and free PCB quotation.

1.3 PCB Specifications

Item	Description	Requirement	Actual
Item	Description	Requirement	Actual
Basic information	Board type	Double sided PCB	Double sided PCB
	Layer count	2 layers	2 layers
	Board size	65 x 71mm=1UP	65 x 71mm=1UP
Laminate	Laminate Type	FR4 TG≧170: CTI:175V-249V	FR4 TG≧170: CTI:175V-249V
	Supplier	/	/
	Tg	TG ≧170℃	TG ≧170℃
	Finished thickness	1.6+/-10% mm	1.57 mm
Plating Thickness	PTH Cu thickness	>20 um	22.13um
	Inner layer Cu Thickness	1/1 OZ	1/1 OZ
	Surface Cu thickness	35 um	45.1 um
Solder Mask	Material type	LP-4G G-05	LP-4G G-05
	Supplier	Nan Ya	Nan Ya
	Color	Green	Green
	Single / both sides	Both Sides	Both Sides
	S/M thickness	>=10.0 um	26.93 um
	3M tape test	NO Peel Off	no peel off
Legend	Material type	S-380W	S-380w
	Supplier	Tai yo	Tai yo
	Color	White	White
	Location	Both Sides	Both Sides
	3M tape test	No peel off	no peel off
Circuit	Trace Width (mm)	0.203+/-20%mm	0.195mm
Circuit	Spacing (mm)	0.203+/- 20%mm	0.199 mm
Electroplated Gold	Nickel	100u"	112u"
Electroplated Gold	Gold	10u"	11.11u"
Reliabilty Tests	Thermal shock test	288±5℃, 10sec ,3 cycles	NO Discolor , NO Delamination
Reliabilty Tests	solder abllity test	245±5℃	100% wetting
Function	Electrioal Test	100%	pass
Standard	IPC-A 600H class 2, IPC_6012C CLASS 2	100%	Pass
Appearance	Visual inspection	100%	Pass
Appearance	warp and twist	<= 0.75%	0.26%
V-Groove	V-Cut thickness	0.4±0.1 mm	0.41mm
V-Groove	Angle	30+/- 5	30º
Drill table (mm)	T1	PTH	0.508+/-0.075mm
	T2	PTH	0.710+/-0.075mm
	T3	NPTH	5.000+/-0.05mm

1.4 Applications

Electric Motor

Bluetooth PC

DC To DC Converter

GPS Chip

USB Wlan Adapter

Rf Transceiver

AC To DC Inverter

Controlled Access

Multicoupler Combiner

Fiber optic receptors

1.5 Our PCB Capability (2022)

Parameter	Value
Layer Counts	1-32
Substrate Material	RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
Maximum Size	Flying test: 900600mm, Fixture test 460380mm, No test 1100*600mm
Board Outline Tolerance	±0.0059" (0.15mm)
PCB Thickness	0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)	±8%
Thickness Tolerance(t＜0.8mm)	±10%
Insulation Layer Thickness	0.00295" - 0.1969" (0.075mm--5.00mm)
Minimum Track	0.003" (0.075mm)
Minimum Space	0.003" (0.075mm)
Outer Copper Thickness	35µm--420µm (1oz-12oz)
Inner Copper Thickness	17µm--350µm (0.5oz - 10oz)
Drill Hole(Mechanical)	0.0059" - 0.25" (0.15mm--6.35mm)
Finished Hole(Mechanical)	0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical)	0.00295" (0.075mm)
Registration (Mechanical)	0.00197" (0.05mm)
Aspect Ratio	12:1
Solder Mask Type	LPI
Min Soldermask Bridge	0.00315" (0.08mm)
Min Soldermask Clearance	0.00197" (0.05mm)
Plug via Diameter	0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance	±10%
Surface Finish	HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask

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