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Brand Name : | Bicheng Enterprise Limited |
Model Number : | BIC-0300-V3.0 |
Certification : | UL |
Price : | USD2 .99-7.99 per piece |
Payment Terms : | T/T,Paypal |
Supply Ability : | 50000 PIECE PER MONTH |
Delivery Time : | 8-9 WORKING DAY |
Unveiling the Unmatched Prowess of TMM10: A Paradigm Shift in PCB Materials
Prepare to embark on an extraordinary journey through the realm of
TMM10, a true game-changer in the world of PCB materials. In this
captivating exploration, we unravel the unparalleled attributes
that set TMM10 apart from the competition. Brace yourself as we
delve into the realm of exceptional performance and unrivaled
capabilities that TMM10 brings to the table.
Elevating the Standards of Electrical Excellence:
TMM10 emerges as a formidable force, boasting awe-inspiring
electrical properties that redefine the boundaries of signal
transmission. With a dielectric constant (εProcess) of 9.20±0.23 at
10 GHz, this material sets the stage for flawless signal integrity
and unmatched communication within high-frequency circuits. Brace
yourself for an unparalleled experience as TMM10 showcases a
dielectric constant (εDesign) of 9.8, delivering unwavering
performance across an impressive frequency range of 8 GHz to 40
GHz, as determined by the Differential Phase Length Method.
Unparalleled Thermal Stability:
TMM10 effortlessly conquers the challenges posed by fluctuating
temperatures, emerging as a champion of thermal stability. Witness
its remarkable thermal coefficient of dielectric constant,
measuring at -38 ppm/℃ within the temperature range of -55℃ to
125℃. Marvel at its ability to maintain peak performance, even
amidst extreme temperature variations.
Indestructible Mechanical Might:
TMM10 is not one to shy away from the rigors of demanding
environments. It presents an unwavering display of mechanical
strength, showcasing a flexural strength (MD/CMD) of 13.62 kpsi and
a flexural modulus (MD/CMD) of 1.79 Mpsi. Prepare to be astounded
as TMM10 defies bending and deformation, standing tall against the
trials of countless applications.
Unleashing the Power of Thermal Conductivity:
Harnessing the force of efficient heat dissipation, TMM10 leaves
competitors in its wake. Marvel at its thermal conductivity of 0.76
W/m/K in the Z-direction at 80℃, as it orchestrates seamless heat
transfer, thwarting the threat of overheating and guaranteeing peak
performance for your electronic masterpieces.
Reliability and Harmony:
In the pursuit of reliability and compatibility, TMM10 emerges
triumphant. With a decomposition temperature (Td) of 425℃, this
material scoffs at the notion of instability, even in the face of
extreme temperatures. Moreover, TMM10 dances in perfect harmony
with lead-free processes, aligning with industry standards and
championing environmentally conscious manufacturing practices.
A Symphony of Remarkable Features:
Beyond its exceptional electrical and thermal prowess, TMM10 boasts
a symphony of additional remarkable attributes. Revel in its volume
resistivity of 2 x 10^8 Mohm.cm and surface resistivity of 4 x 10^7
Mohm, showcasing unwavering reliability. Witness its moisture
absorption rate of 0.09% (for 1.27mm thickness) and a specific
gravity of 2.77, embodying the essence of dependability and
performance in diverse operating conditions.
Unleash the Limitless Potential of TMM10:
TMM10 unveils a world of endless possibilities for high-frequency
applications, revolutionizing the way we approach
telecommunications equipment, aerospace systems, and advanced
electronics. With TMM10 by your side, prepare to witness unrivaled
reliability and performance that elevate your creations to
unparalleled heights.
Experience the unrivaled power of TMM10 and unlock the full
potential of your electronic designs. Embrace TMM10 and embark on a
transformative journey, as you transcend the boundaries of
excellence in high-frequency applications.
TMM10 Typical Value | ||||||
Property | TMM10 | Direction | Units | Condition | Test Method | |
Dielectric Constant, εProcess | 9.20±0.23 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
Dielectric Constant, εDesign | 9.8 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor (process) | 0.0022 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of dielectric constant | -38 | - | ppm/℃ | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
Volume Resistivity | 2 x 108 | - | Mohm.cm | - | ASTM D257 | |
Surface Resistivity | 4 x 107 | - | Mohm | - | ASTM D257 | |
Decomposition Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
Coefficient of Thermal Expansion - X Y Z | 21,21,20 | X,Y,Z | ppm/℃ | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Thermal Conductivity | 0.76 | Z | W/m/K | 80 ℃ | ASTM C518 | |
Copper Peel Strength after Thermal Stress | 5.0 (0.9) | X,Y | lbs/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
Flexural Strength (MD/CMD) | 13.62 | X,Y | kpsi | A | ASTM D790 | |
Flexural Modulus (MD/CMD) | 1.79 | X,Y | Mpsi | A | ASTM D790 | |
Moisture Absorption | 1.27mm (0.050") | 0.09 | - | % | D/24/23 | ASTM D570 |
3.18mm (0.125") | 0.2 | |||||
Specific Gravity | 2.77 | - | - | A | ASTM D792 | |
Specific Heat Capacity | 0.74 | - | J/g/K | A | Calculated | |
Lead-Free Process Compatible | YES | - | - | - | - |
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