Rogers RO4830 High Frequency PCB With Low Profile Copper 5mil and 9.4mil Thermoset Circuit Boards
(Printed Circuit Boards are custom-made products, the picture and
parameters shown are just for reference)
Introduction
Rogers RO4830 high frequency laminates are thermoset materials that
offer a reliable and cost-effective alternative to conventional
PTFE-based laminates. They are particularly well-suited for
millimeter wave applications where cost considerations are
important, such as automotive radar sensors operating in the 76-81
GHz range. RO4830 laminates can be manufactured using standard FR-4
processes and are designed to be used as the cap layer in FR-4
multi-layer board designs commonly employed in 76-81 GHz automotive
radar sensor PCB applications.
Compared to PTFE-woven glass laminates, RO4830 laminates exhibit a
slightly higher dielectric constant of 3.2 at 77 GHz. The use of
low profile reverse treated copper foil cladding contributes to
excellent insertion loss performance of RO4830 laminates at 77 GHz,
achieving 2.2 dB per inch. The laminates also benefit from a flat
woven e-glass and a filler with smaller and more uniform particle
size, resulting in good laser drilling capabilities. Additionally,
RO4830 laminates contain an advanced anti-oxidant package that
provides significant resistance to oxidation, surpassing other
hydrocarbon-based laminate materials. These laminates have a UL 94
V-0 flame retardant rating and are compatible with lead-free solder
processes.
Key Features:
1. Dielectric constant of 3.24
2. Excellent insertion loss of 2.2 dB/in at 77 GHz
3. UL 94 V-0 flame retardant rating
4. Optimized filler, resin, and glass composite system
5. Reverse treated smooth low profile copper foil
Benefits:
- Remarkable resistance to oxidation
- Consistent within-sheet dielectric constant for reliable laser
drilling performance
- Lower overall cost compared to PTFE laminate options, contributing
to reduced PCB manufacturing expenses
- Ideal for automotive radar sensor PCB applications
Our PCB Capability (RO4830)
| PCB Capability (RO4830) |
| PCB Material: | Hydrocarbon/ Ceramic/ Spread Woven Glass |
| Designation: | RO4830 |
| Dielectric constant: | 3.24 |
| Dissipation factor | 0.0033-0.0032 |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 5mil (0.127mm), 9.4mil (0.239mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP,
Bare copper, Pure gold etc.. |
Typical Applications:
76-81 GHz Automotive Radar Sensors
RO4830 Data Sheet
| Property | Typical Values [1]
RO4830(TM) | Units | Condition | Test Method |
| Dielectric Thickness |
| 0.005” | 0.0095” |
| Dielectric Constant, εr Design | 3.24 | 3.24 | - | 77 GHz | microstrip differential phase length |
| Transmission Line Loss | 2.2 | 1.8 | dB/in | 77 GHz | microstrip differential phase length |
| Dissipation Factor, tan δ | 0.0033 | 0.0032 | - | 10 GHz | split-post dielctric resonator |
| Thermal Coefficient of εr (z direction) | -30 | -30 | ppm/°C | -50°C to 150°C | IPC-TM-650 2.5.5.5 |
| Dielectric Strength | 78.7 | 59.1 | kV/mm | 48 hrs @ 50°C | IPC-TM-650, 2.5.6.2 |
| 2000 | 1500 | V/mil |
| Water Absorption | 0.15 | 0.13 | % | D-48/50 | ASTM D570 |
| Peel Strength after Thermal Stress | 0.67 | 0.67 | N/mm | 18 micron reverse
treated EDfoil | IPC-TM-650 2.4.8 |
| 3.8 | 3.8 | lbs/in |
| Flammability Rating | V-0 | V-0 | - | C-48/23/50 | UL94 |
Dimensional
Stability | MD | -1.8
(-1.8) | -1.5 (-1.5) | mm/m (mils/in) | 4 hrs @ 105°C | IPC-TM-650 2.4.39A |
| CMD | -1.8
(-1.8) | -1.6 (-1.6) |
| Decomposition Temperature | 408 | 412 | °C | - | ASTM D3850 |
| Time to Delamination (T288) | >30 | >30 | minutes | with Cu | IPC-TM-650, 2.4.24.1 |
| Lead-Free Process Capable | YES | YES | - | - | - |
| Thermal Conductivity (calculated) | 0.45 | 0.47 | W/mK | 50°C | Through-plane calculation with series
mixing rule |
| CTE | x,y | 23 | 21 | ppm/°C | 0 to 150°C | IPC-TM-650 2.4.41 |
| z | 110 | 83 |
About Bicheng
Established in 2003, Bicheng Electronics Technology Co., Ltd has
become a reputable supplier and exporter of high-frequency PCBs
based in Shenzhen, China. With 20 years of experience, we have been
serving various industries worldwide, including cellular base
station antennas, satellites, high-frequency passive components,
microstrip line and band line circuits, millimeter wave equipment,
radar systems, digital radio frequency antennas, and more.
Our high-frequency PCBs primarily utilize three renowned material
brands: Rogers Corporation, Taconic, and Wangling. These materials
offer a wide range of dielectric constants, ranging from 2.2 to
10.2, ensuring versatility and suitability for different
applications.
In addition to high-frequency PCBs, we also specialize in FR-4
circuit boards, flexible circuits, and metal core PCBs. Our
capabilities cover everything from prototyping and small runs to
large-scale production. Furthermore, we actively engage in research
and development of high-value-added PCB projects, including HDI
(high-density interconnect), quick turn, impedance control, heavy
copper, and backplane boards. This diversification allows us to
offer a comprehensive product line that caters to both low-end and
high-end requirements.
Our PCBs find applications across a wide spectrum of industries,
such as computer networking, safety and surveillance, power supply,
telecommunications, automotive electronics, medical apparatus and
instruments, national defense, and industrial equipment. We strive
to meet the diverse needs of our customers and provide reliable PCB
solutions for various purposes.
