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SMT Stencil For PCB Assembly Solder Paste Laser Profile with 0.1mm stainless steel foil

Shenzhen Bicheng Electronics Technology Co., Ltd
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    Buy cheap SMT Stencil For PCB Assembly Solder Paste Laser Profile with 0.1mm stainless steel foil from wholesalers
     
    Buy cheap SMT Stencil For PCB Assembly Solder Paste Laser Profile with 0.1mm stainless steel foil from wholesalers
    • Buy cheap SMT Stencil For PCB Assembly Solder Paste Laser Profile with 0.1mm stainless steel foil from wholesalers
    • Buy cheap SMT Stencil For PCB Assembly Solder Paste Laser Profile with 0.1mm stainless steel foil from wholesalers
    • Buy cheap SMT Stencil For PCB Assembly Solder Paste Laser Profile with 0.1mm stainless steel foil from wholesalers

    SMT Stencil For PCB Assembly Solder Paste Laser Profile with 0.1mm stainless steel foil

    Ask Lasest Price
    Brand Name : Bicheng Enterprise Limited
    Model Number : BIC-0427-V4.27
    Certification : UL
    Price : USD69~110
    Payment Terms : T/T/Paypal
    Supply Ability : 45000 pieces per month
    Delivery Time : 2-3 working days
    • Product Details
    • Company Profile

    SMT Stencil For PCB Assembly Solder Paste Laser Profile with 0.1mm stainless steel foil

    Product profile


    1.1 General description


    This is a type of solder paste SMT stencil (100% laser cut) built on 0.1mm stainless

    steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated

    per IPC 7525A using supplied Gerber data, squeegee area locating in the center.

    Fiducal marks are through holes to suit for the SMT machine. It’s packed with KK

    carton (hard card) and usually 2 stencils are packed for shipment.


    1.2 Features and benifits


    A. The data file is used directly to produce and reduce the error rate;
    B. The opening position accuracy of SMT template is very high: the whole process

    error is ≤ ±4 μ m;
    C. The opening of SMT template has geometric figure, which is advantageous to

    the printing and forming of tin paste;
    D. Engineering design prevents problems from occurring in pre production;
    E. Money-saving, Worry-saving and Labor-saving;
    F. Door to door shipment service;
    G. More than 9000 types per month;
    H. No minimum order quantity. 1 piece is available;



    1.3 Application


    SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.


    1.4 Parameter and data sheet

    Dimension:370mm x 470mm, 420mm x 520mm, 550mm x 650mm
    StructureStencil foils with aluminum frame
    Base materialStainless steel shim
    Foil Thickness

    0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm,

    0.15mm, 0.18mm, 0.2mm

    Aperture configuredLaser cut
    AppearanceEngraving and electro polishing
    Fiducial markThrough hole
    Service area:Worldwide
    Quantity of open pads:1533
    Advantages:

    a) High precision dimension; b) Good shape on the window;

    c) Hole wall is smoother.

    Application:CSP, BGA, 0.5mm QFP etc. package

    1.5 Opening Hole Design for Stencil

    Component

    Type

    PitchSoldering WidthSoldering LengthOpening WidthOpening LengthShim Thickness
    PLCC1.27mm0.65mm2.00mm0.60mm1.95mm0.15-0.25mm
    QFP0.635mm0.35mm1.50mm0.32mm1.45mm0.15-0.18mm
    QFP0.50mm0.254-0.33mm1.25mm0.22-0.25mm1.20mm0.12-0.15mm
    QFP0.40mm0.25mm1.25mm0.20mm1.20mm0.10-0.12mm
    QFP0.30mm0.20mm1.00mm0.15mm0.95mm0.07-0.12mm
    04020.50mm0.65mm0.45mm0.60mm0.12-0.15mm
    02010.25mm0.40mm0.23mm0.35mm0.07-0.12mm
    BGA1.27mm0.80mm0.75mm0.75mm0.15-0.20mm
    BGA1.00mm0.38mm0.35mm0.35mm0.10-0.12mm
    BGA0.50mm0.30mm0.28mm0.28mm0.07-0.12mm
    Flip Chip0.25mm0.12mm0.12mm0.12mm0.12mm0.08-0.10mm
    Flip Chip0.20mm0.10mm0.10mm0.10mm0.10mm0.05-0.10mm

    Quality SMT Stencil For PCB Assembly Solder Paste Laser Profile with 0.1mm stainless steel foil for sale
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