Home > High Frequency PCB >

TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold

Product Categories

Bicheng Newly shipped PCB [113]
Rogers PCB Board [51]
Taconic PCB Board [38]
PTFE PCB Board [18]
Flexible Printed Circuit [106]
Multilayer PCB Board [14]
High Temperature PCB [9]
HDI PCB Board [11]
Impedance Controlled PCB [14]
PCB Prototypes [15]
Blog [178]
PCB SMT Stencil [5]
Arlon PCB Board [245]
Hybrid PCB Board [211]
FR-4 PCB Board [64]
High Frequency PCB [1]
F4B SERIES PCBS [14]
RF PCB [7]

Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Now

TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold

Ask Lasest Price
Brand Name :	Bicheng Technologies Limited
Model Number :	BIC-105-V6
Certification :	UL
Price :	USD 9.99-99.99
Payment Terms :	T/T, Paypal
Supply Ability :	50000 pieces per month
Delivery Time :	10 working days

Add to Cart

Product Details
Company Profile

TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold

TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

General Description

This is a type of double layer RF PCB which is made on Rogers TMM4 60mil substrate. There’s only 1 NPTH hole in the board with 0.5oz base copper plated to 1oz. The surface finish on pads is immersion gold and no solder mask or silkscreen printed. Track layer is on top and whole bottom layer is copper covered as shielding function. The boards are fabricated as per IPC Class II standard and 100% electrical tested before shipment. Every 25 board are vacuum packed for delivery.

PCB Specifications

PCB SIZE	90 x 90mm=1up
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 17um(0.5 oz)+plate TOP layer
	TMM4 1.524mm
	copper ------- 17um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	100 mil / 100 mil
Minimum / Maximum Holes:	1.5 mm / 1.5 mm
Number of Different Holes:	1
Number of Drill Holes:	1
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	TMM4 1.524mm
Final foil external:	1.0 oz
Final foil internal:	N/A
Final height of PCB:	1.6 mm ±0.16
PLATING AND COATING
Surface Finish	Immersion Gold, 89%
Solder Mask Apply To:	N/A
Solder Mask Color:	N/A
Solder Mask Type:	LPI
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	N/A
Colour of Component Legend	N/A
Manufacturer Name or Logo:	N/A
VIA	N/A
FLAMIBILITY RATING	94V-0
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Typical Applications:

1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems

Our Capability (TMM4)

PCB Material:	Composite of Ceramic, hydrocarbon and thermoset polymer
Designator:	TMM4
Dielectric constant:	4.5 ±0.045 (process); 4.7 (design)
Layer count:	1 Layer, 2 Layer
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion tin, Pure gold (no nickle under gold), OSP.

Data Sheet of TMM4

Property		TMM4	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess		4.5±0.045	Z		10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign		4.7	-	-	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor (process)		0.002	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant		+15	-	ppm/°K	-55℃-125℃	IPC-TM-650 2.5.5.5
Insulation Resistance		>2000	-	Gohm	C/96/60/95	ASTM D257
Volume Resistivity		6 x 108	-	Mohm.cm	-	ASTM D257
Surface Resistivity		1 x 109	-	Mohm	-	ASTM D257
Electrical Strength(dielectric strength)		371	Z	V/mil	-	IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)		425	425	℃TGA	-	ASTM D3850
Coefficient of Thermal Expansion - x		16	X	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y		16	Y	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z		21	Z	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity		0.7	Z	W/m/K	80 ℃	ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress		5.7 (1.0)	X,Y	lb/inch (N/mm)	after solder float 1 oz. EDC	IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)		15.91	X,Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)		1.76	X,Y	Mpsi	A	ASTM D790
Physical Properties
Moisture Absorption (2X2)	1.27mm (0.050")	0.07	-	%	D/24/23	ASTM D570
Moisture Absorption (2X2)	3.18mm (0.125")	0.18	-	%	D/24/23	ASTM D570
Specific Gravity		2.07	-	-	A	ASTM D792
Specific Heat Capacity		0.83	-	J/g/K	A	Calculated
Lead-Free Process Compatible		YES	-	-	-	-

TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Shenzhen Bicheng Electronics Technology Co., Ltd
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

Explore more High Frequency PCB products from this supplier

Find Similar Products By Category:

Electronic Components & Supplies

Hot Searches: