Double Layer Flexible PCB Built On Polyimide with Immersion Gold
and Yellow Coverlay for Tracking Device
(FPC’s are custom-made products, the picture and parameters shown
are just for reference)
General description
This is a type of flexible PCB for the application of Tracking
Device. It’s a 2 layer FPC at 0.15mm thick in a panel form. The
base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2
using supplied Gerber data.
Parameter and data sheet
| Size of Flexible PCB | 119.50 X 50.38=8PCS |
| Number of Layers | 2 |
| Board Type | Flexible PCB |
| Board Thickness | 0.15mm |
| Board Material | Polyimide (PI) 25µm |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60℃ |
|
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 35 µm (1oz) |
|
| Coverlay Colour | Yellow |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | NO |
| Stiffener Thickness | N/A |
|
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
|
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test |
|
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
|
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Features and benefits
Excellent flexibility
Reducing the volume
Weight reduction
Consistency of assembly
Increased reliability
Controllability of electrical parameter design
The end can be whole soldered
Material optionality
Low cost
Continuity of processing
Competitive price
Delivery on time: >98%
Applications
General purpose LED soft light strip, Tablet PC module soft board,
mobile phone module flex board
Brief Introduction of FPC
Flexible Printed Circuit Board (FPC) is referred to as "soft
board". In the industry, FPC is a printed circuit board made of
flexible insulating substrate (mainly polyimide or polyester film),
which has many advantages that rigid printed circuit boards do not
have. For example, it can be freely bent, wound, folded. The volume
of electronic products can be greatly reduced by using FPC, which
is suitable for the development of electronic products in the
direction of high density, miniaturization and high reliability.
Therefore, FPC has been widely used in aerospace, military, mobile
communication, laptop, computer peripherals, PDA, digital camera
and other fields or products.
FPC also has the advantages of good heat dissipation,
solderability, easy mounting and low cost.
Flexible printed circuit board has one layer, two layers and
multilayer board. The base material is polyimide clad laminate.
This kind of material has high heat resistance and good dimensional
stability. It is the final product through pressing with the
coating film which has both mechanical protection and good
electrical insulation. The surface and inner conductors of
double-sided and multi-layer printed circuit boards are metallized
to realize the electrical connection of inner and outer layers.
The function of flexible circuit board can be divided into four
kinds, namely, lead line, printed circuit, connector and
multifunction integrated system, which cover computer, computer
peripheral auxiliary system, consumer household electrical
appliance and automobile, etc.
