Double Sided Flexible PCB Coil Flexible Circuit Polyimide PCB with
Immersion Gold for RFID Sensor
(FPC’s are custom-made products, the picture and parameters shown
are just for reference)
General description
This is a type of flexible printed circuit for the application of
RFID sensor. It’s a 2 layer FPC at 0.2mm thick. The base laminate
is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied
Gerber data.
Parameter and data sheet
| Size of Flexible PCB | 41.61 X 60.17mm |
| Number of Layers | 2 |
| Board Type |
Flexible PCB |
| Board Thickness | 0.20mm |
| Board Material | Polyimide 25µm |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60℃ |
|
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 35 µm |
| |
| Coverlay Colour | Yellow |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | no |
| Stiffener Thickness | N/A |
| |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
|
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test |
|
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
|
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Features and benefits
Excellent flexibility
Reducing the volume
Weight reduction
Consistency of assembly
Increased reliability
The end can be whole soldered
Low cost
Continuity of processing
Provide small quantity, prototypes and production.
Make delivery on time. We keep higher than 98% on-time-delivery
rate.
Applications
Instrument panel, mobile phone antenna flex board, tablet keypad
flex board
Clarifications of FPC
According to the combination of base material and copper foil,
flexible circuit board can be divided into two types: flexible
board with adhesive and flexible board without adhesive. The price
of non-adhesive flexible PCB is much higher than that of adhesive
flexible PCB, but its flexibility, bonding force between copper
foil and substrate and flatness of solder are also better than that
of adhesive flexible PCB. So it is only used in the high demand
situations, such as the: COF (CHIP ON FLEX, flexible board with
bare chip, the high flatness of the pad) and so on. Because its
price is high, most of the flexible PCBs used in the market are
still adhesive flexible circuit board. Because the flexible circuit
board is mainly used in the situation where bending is required, if
the design or process is not reasonable, it is easy to produce
micro-cracks, welding and other defects.
Economy of using FPC
If the circuit design is relatively simple, the total volume is
small, and the space is suitable, the traditional internal
connection is much cheaper. Flexible circuits are a good design
option if the circuit is complex, processes many signals or has
special electrical or mechanical requirements. When the size and
performance of applications exceed the capacity of rigid circuits,
flexible assembly is the most economical. A 12mil pad with a 5mil
through hole and a flexible circuit with 3mil lines and spacing can
be fabricated on a thin film. Therefore, it is more reliable to
mount the chip directly on the film. There is no flame retardant
that could be an ion source. These films may be protective and
solidified at higher temperatures to obtain higher glass transition
temperatures. Flexible materials are less costly than rigid
materials because they are free of connectors.
