Dual Layer Flexible Printed Circuit Board on Polyimide With Yellow
Mask and PI Stiffener for Thin-film Switch
(Flexible printed circuits are custom-made products, the picture
and parameters shown are just for reference)
General description
This is a type of flexible printed circuit for the application of
Controlled Access. It’s a 2 layer FPC at 0.25mm thick. The base
laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using
supplied Gerber data. Polyimide stiffener is applied on the
inserting part.
Parameter and data sheet
| Size of Flexible PCB | 130.18 X 20.5mm |
| Number of Layers | 2 |
| Board Type | Flexible PCB |
| Board Thickness | 0.25mm |
| Board Material | Polyimide 50 µm |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60℃ |
|
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 35 µm |
| |
| Coverlay Colour | Yellow |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 35 µm |
| Stiffener Material | Polyimide |
| Stiffener Thickness | 0.2mm |
| |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
|
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test |
|
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
|
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Features and benefits
Excellent flexibility
Reducing the volume
Weight reduction
Consistency of assembly
Increased reliability
The end can be whole soldered
Low cost
Continuity of processing
Small quantity order is accepted
Engineering design prevents problems from occurring in
pre-production.
Applications
Thin-film switch, mobile phone module flex board, Wireless
Repeater, Modem Router WiFi
Brief Introduction of FPC
Flexible Printed Circuit Board (FPC) is referred to as "soft
board". In the industry, FPC is a printed circuit board made of
flexible insulating substrate (mainly polyimide or polyester film),
which has many advantages that rigid printed circuit boards do not
have. For example, it can be freely bent, wound, folded. The volume
of electronic products can be greatly reduced by using FPC, which
is suitable for the development of electronic products in the
direction of high density, miniaturization and high reliability.
Therefore, FPC has been widely used in aerospace, military, mobile
communication, laptop, computer peripherals, PDA, digital camera
and other fields or products.
FPC also has the advantages of good heat dissipation,
solderability, easy mounting and low cost.
Flexible printed circuit board has one layer, two layers and
multilayer board. The base material is polyimide clad laminate.
This kind of material has high heat resistance and good dimensional
stability. It is the final product through pressing with the
coating film which has both mechanical protection and good
electrical insulation. The surface and inner conductors of
double-sided and multi-layer printed circuit boards are metallized
to realize the electrical connection of inner and outer layers.
The function of flexible circuit board can be divided into four
kinds, namely, lead line, printed circuit, connector and
multifunction integrated system, which cover computer, computer
peripheral auxiliary system, consumer household electrical
appliance and automobile, etc.
