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Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation

Shenzhen Bicheng Electronics Technology Co., Ltd
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    Buy cheap Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation from wholesalers
     
    Buy cheap Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation from wholesalers
    • Buy cheap Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation from wholesalers
    • Buy cheap Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation from wholesalers
    • Buy cheap Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation from wholesalers
    • Buy cheap Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation from wholesalers
    • Buy cheap Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation from wholesalers
    • Buy cheap Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation from wholesalers
    • Buy cheap Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation from wholesalers
    • Buy cheap Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation from wholesalers

    Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation

    Ask Lasest Price
    Brand Name : Bicheng Enterprise Limited
    Model Number : BIC-0309-V3.09
    Certification : UL
    Price : USD2 .99-9.99 per piece
    Payment Terms : T/T,Paypal
    Supply Ability : 50000 PIECE PER MONTH
    Delivery Time : 8-9 WORKING DAY
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    Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation

    Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation
    (Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

    General description
    This is a type of 2 Layer flexible printed circuit (FPC) built on polyimide for the application of PLC Automation.

    Basic specifications
    Base material: Polyimide 25μm + polyimide stiffener +3M sticker
    Layer count: 2 layers
    Type: Individual FPC
    Format: 93mm x 44mm = 1 type = 1 piece
    Surface finish: Immersion gold
    Copper weight: Outer layer 35 μm/ Inner layer 0 μm
    Solder mask / Legend: Yellow coverlay / No.
    Final PCB height: 0.20 mm
    Standard: IPC 6012 Class 2
    Packing: 100 pieces are packed for shipment.
    Lead time: 10 working days
    Shelf life: 6 months



    Features and benefits
    Reliability increased;
    Controllability of electrical parameter design;
    Good oxidation resistance and good heat dissipation;
    Powerful PCB capabilities support your research and development, sales and marketing;
    Delivery on time higher than 98% on-time-delivery rate;
    Quick CADCAM checking and free PCB quotation;
    8000 types of PCB's per month;

    Applications
    industrial control touch remote control soft board, Tablet PC module soft board, mobile phone module flex board, Consumer electrostatic Bracelet soft board, capacitive touch screen / panel, medical equipment controller

    Flexible Printed Circuit (FPC) Capability 2021

    No.SpecificationsCapabilities
    1Board TypeSingle layer, Doulbe layer, Multilayer, Rigid-Flex
    2Base MaterialPI, PET
    3Copper Weight0.5oz, 1oz, 2oz
    4LED Maximum Size250 x 5000mm
    5General Maximum Size250 x 2000mm
    6Board Thickness0.03mm-3.0mm
    7Thickness Tolerance±0.03mm
    8Mininum Drill Hole0.05mm
    9Maximum Drill Hole6.5mm
    10Tolerance of Drill Hole±0.025mm
    11Thickness of Hole Wall≧ 8 um
    12Minimum Track/Gap of Single Layer Board0.025/0.03mm
    13Minimum Track/Gap of Double Layer and Multilayer Board0.03/0.040mm
    14Etching Tolerance±0.02mm
    15Minimum Width of Silk Legend≧ 0.125mm
    16Minimum Heigh of Silk Legend≧0.75mm
    17Distance from Legend to Pad≧0.15mm
    18Distance from Opening Solder Mask of Drill Coverlay to Track≧0.03mm
    19Distance from Opening Solder Mask of Punching Coverlay to Track≧0.03mm
    20Thickness of Immersion Nickel100-300u"
    21Thickness of Immersion Gold1-3u"
    22Thicnkess of Immersion Tin150-400u"
    23Minimum Electrical Testing Pad0.2mm
    24Minimum Tolerance of Outline(Normal Steel Mould Punch)±0.1mm
    25Minimum Tolerance of Outline (Precision Steel Mould Punch)±0.05mm
    26Mininum Radius of Bevel Angle (Outline)0.2mm
    27Stiffner MaterialPI, FR-4, 3M Adhesive, PET, Steel Sheet
    28RoHsYes
    29Solder Mask ColourYellow, White, Black, Green


    Components of a flexible circuit
    A flexible circuit consists of copper foil, dielectric substrate+ coverlay and adhesive.
    Copper foil is available in two different types of copper: ED Copper and RA copper.

    ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper foil used for rigid printed circuit boards. This also means that the copper is “treated”, i.e., it has a slightly rough surface on one side, which ensures a better adhesion when the copper foil is bonded to the base material.

    RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.
    Copper foil is available in thickness of 12, 18, 35 and 70 μm.

    The most common available for dielectric substrate and coverlay is polyimide films. This material can also be used as coverlay. Polyimide is best suited for flexible circuits because of its characteristics as stated below:
    High temperature resistance allows soldering operations without damaging the flexible circuits
    Very good electrical properties
    Good chemical resistance
    Polyimide is available in thicknesses of 12.5, 20, 25 and 50 μm.

    Base laminates for rigid printed circuit boards are copper foils laminated together with the base materials, the adhesive coming from the prepreg material during lamination. Contrary to this is the flexible circuit where the lamination of the copper foil to the film material is achieved by means of an adhesive system. It is necessary to distinguish between two main systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated partly by the processing, and partly by the application of the finished flexible circuit.


















































    Quality Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation for sale
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