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Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

Shenzhen Bicheng Electronics Technology Co., Ltd
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    Buy cheap Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module from wholesalers
     
    Buy cheap Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module from wholesalers
    • Buy cheap Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module from wholesalers
    • Buy cheap Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module from wholesalers
    • Buy cheap Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module from wholesalers
    • Buy cheap Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module from wholesalers
    • Buy cheap Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module from wholesalers
    • Buy cheap Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module from wholesalers

    Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

    Ask Lasest Price
    Brand Name : Bicheng Enterprise Limited
    Model Number : BIC-0313-V3.13
    Certification : UL
    Price : USD2 .99-9.99 per piece
    Payment Terms : T/T,Paypal
    Supply Ability : 50000 PIECE PER MONTH
    Delivery Time : 8-9 WORKING DAY
    • Product Details
    • Company Profile

    Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

    Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

    (Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)


    General description

    This is a type of 2 Layer flexible printed circuit (FPC) built on 2oz polyimide for the application of Interface Module.


    Basic specifications

    Base material: Polyimide 25μm

    Layer count: 2 layers

    Type: Individual FPC

    Format: 105mm x 42.3mm = 1 type = 1 piece

    Surface finish: Immersion gold

    Copper weight: Outer layer 70μm/ Inner layer 0 μm

    Solder mask / Legend: Yellow coverlay / No.

    Final PCB height: 0.25 mm

    Standard: IPC 6012 Class 2

    Packing: 100 pieces are packed for shipment.

    Lead time: 10 working days

    Shelf life: 6 months



    Features and benefits

    Reliability increased;

    Controllability of electrical parameter design;

    The end can be whole soldered;

    SMT process is resistant to reflow soldering, resistant to rework;

    Professional and experienced engineers check your production files

    Competitive price;

    No MOQ, low cost for prototypes and small runs quantity;

    8000 types of PCB's per month;


    Applications

    Thin-film switch, contact belt of inkjet printer, industrial control interphone, medical keypad soft board, contact belt of inkjet printer projector soft board


    Specifications of Standard 2 Layer FCCL

    Double sided adhesiveless flexible copper clad laminate (SF202)
    SpecificationsThickness (µm)Copper TypeApplications
    Polyimide FilmCopper Foil
    SF202 0512DT12.512RTFCamera, LCM, TP etc..
    SF202 0812DT2012RTF
    SF202 1012DT2512RTF
    SF202 0518DT12.518RTFBatter FPC
    SF202 0818DT2018RTF
    SF2021018DT2518RTF
    SF202 0512DR12.512RACamera, LCM, TP etc..
    SF202 0812DR2012RA
    SF202 1012DR2512RA
    SF202 0518DR12.518RA
    SF202 0818DR2018RA
    SF202 1018DR2518RA
    SF202 0535DT12.535RTFBatter FPC
    SF202 1035DT2535RTF
    SF202 0535DR12.535RA
    SF202 1035DR2535RA
    Specifications of New FCCL
    Double sided adhesiveless flexible copper clad laminate (SF202)
    SpecificationsThickness (µm)Copper TypeApplications
    Polyimide FilmCopper Foil
    SF202 0506DR12.56RAFine-line
    SF20200509DR129RA
    SF202 0509DT129RTF
    SF202 0812DR2012RASide switch
    SF202 1012DR2512RA
    SF202 0545DT12.545RTFWireless Charge
    SF202 1045DT2545RTF
    SF202 0550DT12.550RTF
    SF202 1050DT2550RTF
    SF202 0570DT12.570RTF
    SF202 1070DT2570RTF
    SF202 101850DT2518, 50RTF
    SF202 101870DT2518,70RTF

    Clarifications of FPC

    According to the combination of base material and copper foil, flexible circuit board can be divided into two types: flexible board with adhesive and flexible board without adhesive. The price of non-adhesive flexible PCB is much higher than that of adhesive flexible PCB, but its flexibility, bonding force between copper foil and substrate and flatness of solder are also better than that of adhesive flexible PCB. So it is only used in the high demand situations, such as the: COF (CHIP ON FLEX, flexible board with bare chip, the high flatness of the pad) and so on. Because its price is high, most of the flexible PCBs used in the market are still adhesive flexible circuit board. Because the flexible circuit board is mainly used in the situation where bending is required, if the design or process is not reasonable, it is easy to produce micro-cracks, welding and other defects.


    Economy of using FPC

    If the circuit design is relatively simple, the total volume is small, and the space is suitable, the traditional internal connection is much cheaper. Flexible circuits are a good design option if the circuit is complex, processes many signals or has special electrical or mechanical requirements. When the size and performance of applications exceed the capacity of rigid circuits, flexible assembly is the most economical. A 12mil pad with a 5mil through hole and a flexible circuit with 3mil lines and spacing can be fabricated on a thin film. Therefore, it is more reliable to mount the chip directly on the film. There is no flame retardant that could be an ion source. These films may be protective and solidified at higher temperatures to obtain higher glass transition temperatures. Flexible materials are less costly than rigid materials because they are free of connectors.

    Quality Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module for sale
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