Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Black Coverlay for Display Carrier
(Flexible printed circuits are custom-made products, the picture
and parameters shown are just for reference)
General description
This is a type of 2 Layer flexible printed circuit (FPC) built on
1oz polyimide for the application of display carrier.
Basic specifications
Base material: Polyimide 25μm + 0.3mm stiffener of FR-4 and 0.1mm
Stainless steel
Layer count: 2 layers
Type: Individual FPC
Format: 92.1mm x 54mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35μm/ Inner layer 0 μm
Solder mask / Legend: Black coverlay / White
Final PCB height: 0.5 mm
Standard: IPC 6012 Class 2
Packing: 100 pieces are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
Features and benefits
The end can be whole soldered;
Low cost;
Continuity of processing;
Excellent surface planarity to reduce failure rate during assembly
and soldering;
Meeting your PCB needs from prototype to mass production;
Powerful PCB capabilities support your research and development,
sales and marketing;
Delivery on time higher than 98% on-time-delivery rate;
More than 18 years of PCB experience;
Applications
Keypad FPC, LCD module, Industrial control computer soft board, FFC
for industrial control equipment
Specifications of standard coverlay
| Halogen-free flame-resistant type polyimide film based Coverly
(SF305C) |
| Specifications | Polyimide Film Thickness (µm) | Adhesive Thickness (µm) | Applications |
|
| SF305C 0205 | 5 | 5 | Ultrathin FPC |
| SF305C 0305 | 7.5 | 5 |
| SF305C 0309 | 7.5 | 9 |
| SF305C 0515 | 12.5 | 15 | General type |
| SF305C 0520 | 12.5 | 20 |
| SF305C 0525 | 12.5 | 25 |
| SF305C 1025 | 25 | 25 |
| SF305C 1030 | 25 | 30 |
| SF305C 1035 | 25 | 35 | Power batter |
| SF305C 1050 | 25 | 50 |
| SF305C 2050 | 50 | 50 |
Components of a Flexible Circuit
A flexible circuit consists of copper foil, dielectric substrate+ coverlay and adhesive.
Copper foil is available in two different types of copper: ED
Copper and RA copper.
ED copper is an electro-deposited (ED) copper foil produced in the same way
as the copper foil used for rigid printed circuit boards. This also
means that the copper is “treated”, i.e., it has a slightly rough
surface on one side, which ensures a better adhesion when the
copper foil is bonded to the base material.
RA copper is a rolled and annealed copper foil produced from
electrolytically deposited cathode copper, which is melted and cast
into ingots. The ingots are first hot-rolled to a certain size and
milled on all surfaces. The copper is then cold-rolled and
annealed, until the desired thickness is obtained.
Copper foil is available in thickness of 12, 18, 35 and 70 μm.
The most common available for dielectric substrate and coverlay is polyimide films. This material can also be used as
coverlay. Polyimide is best suited for flexible circuits because of
its characteristics as stated below:
High temperature resistance allows soldering operations without
damaging the flexible circuits
Very good electrical properties
Good chemical resistance
Polyimide is available in thicknesses of 12.5, 20, 25 and 50 μm.
Base laminates for rigid printed circuit boards are copper foils
laminated together with the base materials, the adhesive coming from the prepreg material during lamination. Contrary to
this is the flexible circuit where the lamination of the copper
foil to the film material is achieved by means of an adhesive
system. It is necessary to distinguish between two main systems of
adhesive, namely thermoplastic and thermoset adhesives. The choice
is dictated partly by the processing, and partly by the application
of the finished flexible circuit.
