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RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

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Rogers 3203 PCB RO3203 High Frequency PCB Double Sided RF Circuit Board For Base Station Infrastructure

Shenzhen Bicheng Electronics Technology Co., Ltd
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    Buy cheap Rogers 3203 PCB RO3203 High Frequency PCB Double Sided RF Circuit Board For Base Station Infrastructure from wholesalers
     
    Buy cheap Rogers 3203 PCB RO3203 High Frequency PCB Double Sided RF Circuit Board For Base Station Infrastructure from wholesalers
    • Buy cheap Rogers 3203 PCB RO3203 High Frequency PCB Double Sided RF Circuit Board For Base Station Infrastructure from wholesalers
    • Buy cheap Rogers 3203 PCB RO3203 High Frequency PCB Double Sided RF Circuit Board For Base Station Infrastructure from wholesalers

    Rogers 3203 PCB RO3203 High Frequency PCB Double Sided RF Circuit Board For Base Station Infrastructure

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    Brand Name : Bicheng Technologies Limited
    Model Number : BIC-124-V0.10
    Certification : UL
    Price : USD 2.99-8.99 PER PIECE
    Payment Terms : T/T, Western Union
    Supply Ability : 45000 pieces per month
    Delivery Time : 10 working days
    • Product Details
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    Rogers 3203 PCB RO3203 High Frequency PCB Double Sided RF Circuit Board For Base Station Infrastructure

    Rogers 3203 PCB RO3203 High Frequency PCB Double Sided RF Circuit Board For Base Station Infrastructure
    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

    RO3203 High Frequency Circuit Materials of Rogers Corporation are ceramic-filled laminates reinforced with woven fiberglass. This material is engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The dielectric constant of RO3203 High Frequency Circuit Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz.

    RO3203 laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate. These materials can be fabricated into printed circuit boards using
    standard PTFE circuit board processing techniques. Available cladding options are 0.5, 1 or 2 oz./ft2 (17, 35, 70 micron thick) electrodeposited copper foil. These laminates are manufactured under an ISO 9002 certified quality system.



    Features:
    1. Woven glass reinforcement improves rigidity for easier handling.
    2. Uniform electrical and mechanical performance is ideal for complex multilayer high frequency structures.
    3. Low dielectric loss for high frequency performance can be used in applications exceeding 20 GHz.
    4. Excellent mechanical properties over a wide range of dielectric constants are ideal for multilayer board designs.
    5. Low in-plane expansion coefficient (matched to copper) is suitable for use with epoxy glass multilayer board hybrid designs
    and reliable surface mounted assemblies.
    6. Excellent dimensional stability for high production yields.
    7. Economically priced for volume manufacturing.
    8. Surface smoothness allows for finer line etching tolerances

    Typical Applications:
    1. Automotive Collision Avoidance Systems
    2. Automotive Global Positioning Satellite Antennas
    3. Base Station Infrastructure
    4. Datalink on Cable Systems
    5. Direct Broadcast Satellites
    6. LMDS and Wireless Broadband
    7. Microstrip Patch Antennas
    8. Power Backplanes
    9. Remote Meter Readers
    10. Wireless Telecommunications Systems

    PCB Capability (RO3203)

    PCB Material:Ceramic-filled Laminates Reinforced with Woven Fiberglass
    Designation:RO3203
    Dielectric constant:3.02±0.04
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP etc..


    Data Sheet of RO3203

    PropertyRO3203DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.02±0.04Z10 GHz/23℃IPC-TM-650 2.5.5.5
    Dissipation Factor,tanδ0.0016Z10 GHz/23℃IPC-TM-650 2.5.5.5
    Thermal Conductivity0.47 (3.2)W/mKFloat 100℃ASTM C518
    Volume Resistivity107MΩ.cmAASTM D257
    Surface Resistivity107AASTM D257
    Dimensional Stability0.08X, Ymm/m +E2/150after etchIPC-TM-650 2.4.3.9
    Tensile ModulusX YkpsiRTASTM D638
    Flexural Modulus400 300X YkpsiAASTM D790
    Tensile Strength12.5 13X YkpsiRTASTM D638
    Flexural Strength9 8X YkpsiAASTM D790
    Moisure Absorption<0.1%D24/23IPC-TM-650 2.6.2.1
    Coefficient of Thermal Expansion58 13Z X,Yppm/℃-50 ℃to 288℃ASTM D3386
    Td500TGAASTM D3850
    Density2.1gm/cm323℃ASTM D792
    Copper Peel Stength10 (1.74)lbs/in (N/mm)After solderIPC-TM-650 2.4.8
    FlammabilityV-0UL 94
    Lead-Free Process CompatibleYes







































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