Rogers 6035 High Frequency PCB Built On Dual Layer 30mil Core With
Immersion Gold for Power Dividers
(Printed Circuit Boards are custom-made products, the picture and
parameters shown are just for reference)
RT/duroid 6035HTC high frequency circuit materials of Rogers
Corporation are ceramic filled PTFE composites for use in high
power RF and microwave applications. With a thermal conductivity of
almost 2.4 times the standard RT/duroid 6000 products, and
copper foil (electrodeposited and reverse treat) with excellent
long term thermal stability, RT/duroid 6035HTC laminates are an
exceptional choice for high power applications.
Features/Benefits:
1. High Thermal conductivity
Improved dielectric heat dissipation enables lower operating
temperatures for high power applications
2. Low loss tangent
Excellent high frequency performance
3.Thermally stable low profile and reverse treat copper foil
Lower insertion loss and excellent thermal stability of traces
4. Advanced filler system
Improved drill ability and extended tool life compared to alumina
containing circuit materials
Some Typical Applications:
1. High Power RF and Microwave Amplifiers
2. Power Amplifiers, Couplers, Filters
3. Combiners, Power Dividers
PCB Capability (RT/duroid 6035HTC)
| PCB Material: | Ceramic-filled PTFE composites |
| Designation: | RT/duroid 6035HTC |
| Dielectric constant: | 3.50±0.05 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Data Sheet of RT/duroid 6035HTC
| Property | RT/duorid 6035HTC | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.50±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
|
| Dielectric Constant,εDesign | 3.6 | Z | | 8 GHz - 40 GHz | Differential Phase Length Method |
|
| Dissipation Factor | 0.0013 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -66 | Z | ppm/℃ | -50 ℃to 150℃ | mod IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 108 | | MΩ.cm | A | IPC-TM-650, 2.5.17.1 |
| Surface Resistivity | 108 | | MΩ | A | IPC-TM-650, 2.5.17.1 |
| Dimensional Stability | -0.11 -0.08 | CMD MD | mm/m (mils/inch) | 0.030" 1oz EDC foil Thickness after etch '+E4/105 | IPC-TM-650 2.4.39A |
| Tensile Modulus | 329 244 | MD CMD | kpsi | 40 hrs @23℃/50RH | ASTM D638 |
| Moisure Absorption | 0.06 | | % | D24/23 | IPC-TM-650 2.6.2.1 ASTM D570 |
| Coefficient of Thermal Expansion (-50 ℃to 288 ℃) | 19 19 39 | X Y Z | ppm/℃ | 23℃ / 50% RH | IPC-TM-650 2.4.41 |
| Thermal Conductivity | 1.44 | | W/m/k | 80℃ | ASTM C518 |
| Density | 2.2 | | gm/cm3 | 23℃ | ASTM D792 |
| Copper Peel Stength | 7.9 | | pli | 20 sec. @288 ℃ | IPC-TM-650 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-Free Process Compatible | Yes | | | | |
