RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications
(Printed Circuit Boards are custom-made products, the picture and
parameters shown are just for reference)
RO4350B LoPro laminates use a proprietary Rogers' technology that
allows reverse treated foil to bond to standard RO4350B dielectric.
This results in a laminate with low conductor loss for improved
insertion loss and signal integrity while maintaining all other
desirable attributes of the standard RO4350B laminate system.
Features and Benefits:
RO4350B materials are reinforced hydrocarbon/ceramic laminates with
very low profile reverse treated foil.
1. Lower insertion loss
2. Low PIM
3. Increased signal integrity
4. High circuit density
Low Z-axis coefficient of thermal expansion
1. Multi-layer board capability
2. Design flexibility
Lead-free process compatible
1. High temperature processing
2. Meets environmental concerns
CAF resistant
Our PCB Capability (RO4350B LoPro)
| PCB Material: | Hydrocarbon Ceramic Laminates |
| Designation: | RO4350B LoPro |
| Dielectric constant: | 3.48±0.05 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10.7mil (0.272mm), 14mil (0.356mm), 17.3mil (0.439mm),
20.7mil(0.526mm), 30.7mil (0.780mm), 60.7mil(1.542mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
Some Typical Applications:
1. Digital applications such as servers, routers, and high speed
back planes
2. Cellular base station antennas and power amplifiers
3. LNB’s for direct broadcast satellites
4. RF Identification Tags
Typical Properties of RO4350B LoPro
| Property | Typical Value | Direction | Units | Condition | Test Method |
| Dielectric Constant, Process | 3.48 ± 0.05 | z | -- | 10 GHz/23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant, Design | 3.55 | z | -- | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factor tan, | 0.0037 0.0031 | z | -- | 10 GHz/23°C 2.5 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coeffifi cient of r | 50 | z | ppm/°C | -50°C to 150°C | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 X 1010 | | MΩ•cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 5.7 X 109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | z | KV/mm(V/mil) | 0.51mm(0.020”) | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 11473(1664) | Y | MPa(kpsi) | RT | ASTM D638 |
| Tensile Strength | 175(25.4) | Y | MPa(kpsi) | RT | ASTM D638 |
| Flexural Strength | 255(37) | | MPa(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.5 | X,Y | mm/m(mils/inch) | after etch +E2/150°C | IPC-TM-650 2.4.39A |
| Coeffifi cient of Thermal Expansion | 14 | x | ppm/°C | -55 to 288°C | IPC-TM-650 2.1.41 |
| 16 | y |
| 35 | z |
| Tg | >280 | | °C TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 390 | | °C TGA | | ASTM D3850 |
| Thermal Conductivity | 0.62 | | W/m/°K | 80°C | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48 hrs immersion 0.060” sample Temperature 50°C | ASTM D570 |
| Density | 1.86 | | gm/cm3 | 23°C | ASTM D792 |
| Copper Peel Strength | 0.88(5.0) | | N/mm(pli) | after solder float 1 oz. TC Foil | IPC-TM-650 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-Free Process Compatible | Yes | | | | |
