20mil Rogers TC350 High Frequency PCB On Double Sided Core With
Immersion Gold for Filters and Couplers
(Printed Circuit Boards are custom-made products, the picture and
parameters shown are just for reference)
Rogers' TC350 is a woven fiberglass reinforced, ceramic filled,
PTFE based composite for use as making printed circuit board.TC350
is designed to provide enhanced heat-transfer through
“Best-In-Class” thermal conductivity, while reducing dielectric
loss and insertion loss. Lower losses result in higher Amplifier
and Antenna Gains/Efficiencies.
Features & Benefits:
1. The increased thermal conductivity of TC350 provides higher
power handling, reduces hot-spots and improves device reliability.
This results in reduced junction temperatures and extends the life
of active components, which is critical for improving power
amplifier reliability, extending MTBF and reducing warranty costs.
2. TC350 has excellent Dielectric Constant Stability across a wide
temperature range. This helps Power Amplifier and Antenna designers
maximize gain and minimize dead bandwidth lost to dielectric
constant drift as operating temperature changes.
3. TC350 enjoys a strong bond to copper, utilizing microwave grade,
low profile copper. This results in even lower insertion loss due
to skin effect losses of copper that are more obvious at higher RF
and microwave frequencies.
Our PCB Capabilities (TC350)
| PCB Material: | Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite |
| Designation: | TC350 |
| Dielectric constant: | 3.5±0.05 |
| Thermal Conductivity | 0.72 W/m-K |
| Dissipation Factor | Df .002@10 GHz |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
Typical Applications:
1. Microwave Combiner and Power Dividers
2. Power Amplifiers, Filters and Couplers
3. Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)
4. Thermally Cycled Antennas sensitive to dielectric drift
Typical Properties of TC350
| Property | Units | Value | Test Merthod |
| 1. Electrical Properties | |
| Dielectric Constant (may vary by thickness) | | | |
| @1 MHz | － | 3.50 | IPC TM-650 2.5.5.3 |
| @1.8 GHz | － | 3.50 | RESONANT CAVITY |
| @10 GHz | － | 3.50 | IPC TM-650 2.5.5.5 |
| Dissipation Factor | | | |
| @1 MHz | － | 0.0015 | IPC TM-650 2.5.5.3 |
| @1.8 GHz | － | 0.0018 | RESONANT CAVITY |
| @10 GHz | － | 0.0020 | IPC TM-650 2.5.5.5 |
| Temperature Coefficient of Dielectric | － | | |
| TC r @ 10 GHz (-40-150°C) | ppm/ºC | -9 | IPC TM-650 2.5.5.5 |
| Volume Resistivity | | | |
| C96/35/90 | MΩ-cm | 7.4x106 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ-cm | 1.4x108 | |
| Surface Resistivity | | | |
| C96/35/90 | MΩ | 3.2x107 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ | 4.3x108 | IPC TM-650 2.5.17.1 |
| Electrical Strength | Volts/mil (kV/mm) | 780 (31) | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | kV | 40 | IPC TM-650 2.5.6 |
| Arc Resistance | sec | >240 | IPC TM-650 2.5.1 |
| 2.Thermal Properties | |
| Decomposition Temperature (Td) | | | |
| Initial | °C | 520 | IPC TM-650 2.4.24.6 |
| 5% | °C | 567 | IPC TM-650 2.4.24.6 |
| T260 | min | >60 | IPC TM-650 2.4.24.1 |
| T288 | min | >60 | IPC TM-650 2.4.24.1 |
| T300 | min | >60 | IPC TM-650 2.4.24.1 |
| Thermal Expansion, CTE (x,y) 50-150ºC | ppm/ºC | 7, 7 | IPC TM-650 2.4.41 |
| Thermal Expansion, CTE (z) 50-150ºC | ppm/ºC | 12 | IPC TM-650 2.4.24 |
| % z-axis Expansion (50-260ºC) | % | 1.2 | IPC TM-650 2.4.24 |
| 3. Mechanical Properties | |
| Peel Strength to Copper (1 oz/35 micron) | | | |
| After Thermal Stress | lb/in (N/mm) | 7 (1.2) | IPC TM-650 2.4.8 |
| At Elevated Temperatures (150ºC) | lb/in (N/mm) | 9 (1.6) | IPC TM-650 2.4.8.2 |
| After Process Solutions | lb/in (N/mm) | 7 (1.2) | IPC TM-650 2.4.8 |
| Young’s Modulus | kpsi (MPa) | | IPC TM-650 2.4.18.3 |
| Flexural Strength (Machine/Cross) | kpsi (MPa) | 14/10 (97/69) | IPC TM-650 2.4.4 |
| Tensile Strength (Machine/Cross) | kpsi (MPa) | 11/8 (76/55) | IPC TM-650 2.4.18.3 |
| Compressive Modulus | kpsi (MPa) | | ASTM D-3410 |
| Poisson’s Ratio | － | | ASTM D-3039 |
| 4. Physical Properties | |
| Water Absorption | % | 0.05 | IPC TM-650 2.6.2.1 |
| Density, ambient 23ºC | g/cm3 | 2.30 | ASTM D792 Method A |
| Thermal Conductivity | W/mK | 0.72 | ASTM D5470 |
| Specific Heat | J/gK | 0.90 | ASTM D5470 |
| Flammability | class | V0 | UL-94 |
| NASA Outgassing, 125ºC, ≤10- 6 torr | | | |
| Total Mass Loss | % | 0.02 | NASA SP-R-0022A |
| Collected Volatiles | % | 0.01 | NASA SP-R-0022A |
| Water Vapor Recovered | % | 0.01 | NASA SP-R-0022A |
