Rogers 3210 PCB RO3210 High Frequency PCB
Hello Everyone,
Today we’re talking about RO3210 high frequency PCBs.
RO3210 high frequency circuit laminates are ceramic-filled
laminates reinforced with woven fiberglass. RO3210 material was
designed as an extension of the RO3000 series high frequency
circuit materials with one distinguishing characteristic-- improved
mechanical stability.
Features and benefits are as follows:
1. Woven glass reinforcement, improves rigidity for easier
handling.
2, Uniform electrical and mechanical performance, is ideal for
complex multi-layer high frequency structure.
3. Low in-plane expansion coefficient matches to copper, which is
reliable for surface mounted assemblies; which is suitable for use
with epoxy multi-layer board hybrid designs.
4. Excellent dimensional stability, results in high production
yields.
5. Surface smoothness, allows for finer line etching tolerance.
PCB Capability
| PCB Material: | Ceramic-filled Laminates |
| Designation: | RO3210 |
| Dielectric constant: | 10.2 ±0.5 (process) |
| 10.8 (design) |
| Layer count: | 2 Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 25mil (0.635mm), 50mil (1.27mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
| | |
Double layer RO3210 high frequency PCBs are available with 0.5oz to
2oz finished copper, 0.7mm and 1.3mm thick, maximum size 400mm by
500mm, surface finish with bare copper, hot air leveling, immersion
gold etc.
Typical applications are
1. Automotive collision avoidance systems.
2. Automotive global positions satellite antennas
3. Base station infrastructure
4. Datalink on cable systems
5. Direct broadcast satellite
6. LMDS and wireless broadband
7. Microstrip patch antennas for wireless communications
8. Power backplanes
9. Remote meter readers
10. Wireless telecommunications systems
The basic colour of RO3210 PCB is white.
The manufacturing process of RO3210 high frequency PCB is similar
to standard PTFE PCB, so it’s suitable for volume manufacturing
process winning advantageous market.
Should you have any questions, please feel free to contact us.
Thank you for your reading.
Appendix
Data sheet of RO3210 high frequency circuit material
| RO3210 Typical Value |
| Property | RO3210 | Direction | Units | Condition | Test Method |
| Dielectric Constant, ε Process | 10.2±0.5 | Z | | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant, ε Design | 10.8 | Z | | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor, tanδ | 0.0027 | Z | | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -459 | Z | ppm/℃ | 10 GHz 0℃to 100℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.8 | X, Y | mm/m | COND A | ASTM D257 |
| Volume Resistivity | 103 | | MΩ.cm | COND A | IPC 2.5.17.1 |
| Surface Resistivity | 103 | | MΩ | COND A | IPC 2.5.17.1 |
| Tensile Modulus | 579
517 | MD
CMD | kpsi | 23℃ | ASTM D 638 |
| Water Absorption | ＜0.1 | - | % | D24/23 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.79 | | j/g/k | | Calculated |
| Thermal Conductivity | 0.81 | | W/M/K | 80℃ | ASTM C518 |
Coefficient of Thermal Expansion
(-55 to 288℃) | 13
34 | X,Y
Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | | ℃ | TGA | ASTM D3850 |
| Density | 3 | | gm/cm3 | | |
| Copper Peel Strength | 11 | | pli | 1oz,EDC After Solder Float | IPC-TM 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
