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Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

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Rogers 4003 12mil 0.305mm High Frequency PCB RO4003C Double Sided RF PCB for Antennas

Shenzhen Bicheng Electronics Technology Co., Ltd
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    Buy cheap Rogers 4003 12mil 0.305mm High Frequency PCB RO4003C Double Sided RF PCB for Antennas from wholesalers
     
    Buy cheap Rogers 4003 12mil 0.305mm High Frequency PCB RO4003C Double Sided RF PCB for Antennas from wholesalers
    • Buy cheap Rogers 4003 12mil 0.305mm High Frequency PCB RO4003C Double Sided RF PCB for Antennas from wholesalers
    • Buy cheap Rogers 4003 12mil 0.305mm High Frequency PCB RO4003C Double Sided RF PCB for Antennas from wholesalers
    • Buy cheap Rogers 4003 12mil 0.305mm High Frequency PCB RO4003C Double Sided RF PCB for Antennas from wholesalers

    Rogers 4003 12mil 0.305mm High Frequency PCB RO4003C Double Sided RF PCB for Antennas

    Ask Lasest Price
    Brand Name : Bicheng Technologies Limited
    Model Number : BIC-008-V0.47
    Certification : UL
    Price : USD 2.99-9.99 PER PIECE
    Payment Terms : T/T, Western Union
    Supply Ability : 45000 pieces per month
    Delivery Time : 10 working days
    • Product Details
    • Company Profile

    Rogers 4003 12mil 0.305mm High Frequency PCB RO4003C Double Sided RF PCB for Antennas

    Rogers 4003 12mil 0.305mm High Frequency PCB RO4003C Double Sided RF PCB for Antennas

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    RO4003C hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above. RO4003C material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. Low dielectric loss allows RO4003C material to be used in many applications where higher operating frequencies limit the use of conventional circuit board materials.



    The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range. RO4003C material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4003C is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4003C provides reliable plated through-hole quality, even in severe thermal shock applications. RO4003C material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.


    PCB Specifications

    PCB SIZE67 x 67mm=1up
    BOARD TYPEDouble sided PCB
    Number of Layers2 layers
    Surface Mount ComponentsYES
    Through Hole ComponentsNO
    LAYER STACKUPcopper ------- 35um(1 oz)+plate TOP layer
    RO4003C 0.305mm
    copper ------- 35um(1oz) + plate BOT Layer
    TECHNOLOGY
    Minimum Trace and Space:7.9 mil / 5.9 mil
    Minimum / Maximum Holes:0.4 mm / 0.4 mm
    Number of Different Holes:1
    Number of Drill Holes:3
    Number of Milled Slots:0
    Number of Internal Cutouts:0
    Impedance Control:no
    Number of Gold finger:0
    BOARD MATERIAL
    Glass Epoxy:RO4003C Tg280℃, er<3.48, Rogers Corp.
    Final foil external:1.5 oz
    Final foil internal:N/A
    Final height of PCB:0.4 mm ±0.1
    PLATING AND COATING
    Surface FinishImmersion gold, 18%
    Solder Mask Apply To:N/A
    Solder Mask Color:N/A
    Solder Mask Type:N/A
    CONTOUR/CUTTINGRouting
    MARKING
    Side of Component LegendN/A
    Colour of Component LegendN/A
    Manufacturer Name or Logo:N/A
    VIAPlated through hole(PTH), minimum size 0.4mm.
    FLAMIBILITY RATINGN/A
    DIMENSION TOLERANCE
    Outline dimension:0.0059"
    Board plating:0.0029"
    Drill tolerance:0.002"
    TEST100% Electrical Test prior shipment
    TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
    SERVICE AREAWorldwide, Globally.

    Typical applications are as follows:

    Automotive Radar and Sensors

    Cellular Base Station Antennas

    Direct Broadcast Satellites

    Low Noise Block

    Power amplifiers

    RFID



    Data Sheet of Rogers 4003C (RO4003C)

    RO4003C Typical Value
    PropertyRO4003CDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.38±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.55Z8 to 40 GHzDifferential Phase Length Method
    Dissipation Factortan,δ0.0027
    0.0021
    Z10 GHz/23℃
    2.5 GHz/23℃
    IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε+40Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
    Volume Resistivity1.7 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity4.2 x 109COND AIPC-TM-650 2.5.17.1
    Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
    Tensile Modulus19,650(2,850)
    19,450(2,821)
    X
    Y
    MPa(ksi)RTASTM D 638
    Tensile Strength139(20.2)
    100(14.5)
    X
    Y
    MPa(ksi)RTASTM D 638
    Flexural Strength276
    (40)
    MPa
    (kpsi)
    IPC-TM-650 2.4.4
    Dimensional Stability<0.3X,Ymm/m
    (mil/inch)
    after etch+E2/150℃IPC-TM-650 2.4.39A
    Coefficient of Thermal Expansion11
    14
    46
    X
    Y
    Z
    ppm/℃-55℃to288℃IPC-TM-650 2.4.41
    Tg>280℃ TMAAIPC-TM-650 2.4.24.3
    Td425℃ TGAASTM D 3850
    Thermal Conductivity0.71W/M/oK80℃ASTM C518
    Moisture Absorption0.06%48hrs immersion 0.060"
    sample Temperature 50℃
    ASTM D 570
    Density1.79gm/cm323℃ASTM D 792
    Copper Peel Stength1.05
    (6.0)
    N/mm
    (pli)
    after solder float 1 oz.
    EDC Foil
    IPC-TM-650 2.4.8
    FlammabilityN/AUL 94
    Lead-free Process CompatibleYes


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