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High Tg Lead Free Multilayer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

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Shenzhen Bicheng Electronics Technology Co., Ltd

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High Tg Lead Free Multilayer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

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Brand Name :	Bicheng Technologies Limited
Model Number :	BIC-502-V0.55
Certification :	UL
Price :	USD 2.99-9.99 PER PIECE
Payment Terms :	T/T, Western Union
Supply Ability :	45000 pieces per month
Delivery Time :	10 working days

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High Tg Lead Free Multilayer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

High Tg Lead Free Multilayer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

Main Applications

Consumer Electronics

Server, workstation

Automotive

Key Features

Lead Free process compatible

Excellent coefficient of thermal expansion

Anti-CAF property

Superior chemical and thermal resistance

Fluorescence for AOI

Moisture resistance

Our PCB Capability (TU-768)

PCB Material:	High-Tg and High Thermal Reliability Epoxy Resin
Designation:	TU-768
Dielectric constant:	4.3
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness:	10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology:	HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

Typical Properties of TU-768

	Typical Values	Conditioning	IPC-4101 /126
Thermal
Tg (DMA)	190°C
Tg (DSC)	180°C		> 170°C
Tg (TMA)	170°C	E-2/105
Td (TGA)	350°C		> 340°C
CTE x-axis	11~15 ppm/°C		N/A
CTE y-axis	11~15 ppm/°C	E-2/105	N/A
CTE z-axis	2.70%		< 3.0%
Thermal Stress,Solder Float, 288°C	> 60 sec	A	> 10 sec
T260	> 60 min		> 30 min
T288	> 20 min	E-2/105	> 15 min
T300	> 2 min		> 2 min
Flammability	94V-0	E-24/125	94V-0
DK & DF
Permittivity (RC 50%) @10GHz	4.3
Loss Tangent (RC 50%) @10GHz	0.018
Electrical
Permittivity (RC50%)
1GHz (SPC method/4291B)	4.4 / 4.3		< 5.2
5GHz (SPC method)	4.3	E-2/105	N/A
10GHz (SPC method)	4.3		N/A
Loss Tangent (RC50%)
1GHz (SPC method/4291B)	0.019 /0.018		< 0.035
5GHz (SPC method)	0.021	E-2/105	N/A
10GHz (SPC method)	0.023		N/A
Volume Resistivity	> 1010 MΩ•cm	C-96/35/90	> 106 MΩ•cm
Surface Resistivity	> 108 MΩ	C-96/35/90	> 104 MΩ
Electric Strength	> 40 KV/mm	A	> 30 KV/mm
Dielectric Breakdown	> 50 kV	A	> 40 KV
Mechanical
Young’s Modulus
Warp Direction	25 GPa	A	N/A
Fill Direction	22 GPa
Flexural Strength
Lengthwise	> 60,000 psi	A	> 60,000 psi
Crosswise	> 50,000 psi	A	> 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil	7~9 lb/in	A	> 4 lb/in
Water Absorption	0.18%	E-1/105+D-24/23	< 0.8 %

High Tg Lead Free Multilayer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

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