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Taconic High Frequency PCB Built on RF-35TC 60mil 1.524mm With Immersion Gold for Satellites

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Shenzhen Bicheng Electronics Technology Co., Ltd

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Taconic High Frequency PCB Built on RF-35TC 60mil 1.524mm With Immersion Gold for Satellites

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Brand Name :	Bicheng Technologies Limited
Model Number :	BIC-0027-V0.65
Certification :	UL
Price :	USD 2.99-9.99 PER PIECE
Payment Terms :	T/T, Western Union
Supply Ability :	45000 pieces per month
Delivery Time :	10 working days

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Taconic High Frequency PCB Built on RF-35TC 60mil 1.524mm With Immersion Gold for Satellites

Taconic High Frequency PCB Built on RF-35TC 60mil 1.524mm With Immersion Gold for Satellites

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

RF-35TC is a type of high frequency material from Taconic company. It offers a "best in class" low dissipation factor with high thermal conductivity. This material is best suited for high power applications where every 1/10th of a dB is critical and the PCB substrate is expected to diffuse heat away from both transmission lines and surface mount components such as transistors.

RF-35TC is a PTFE based, ceramic filled fiberglass substrate. It will not oxidize, yellow or show upward drift in dielectric constant and dissipation factor like its synthetic rubber (hydrocarbon) competitors.

This laminate has a low dielectric constant value of 3.50 and has extremely low Df of 0.0011. It provides a low dissipation factor with high thermal conductivity and bonds very well to low profile copper, further reducing insertion loss.

The RF-35TC laminates are ideal for antennas, satellites, filters, couplers and power amplifiers.

PCB Specifications

PCB SIZE	132 x 58mm=1PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 35um(1 oz)+plate TOP layer
	RF-35TC 1.524mm
	copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	7 mil / 7 mil
Minimum / Maximum Holes:	N/A
Number of Different Holes:	N/A
Number of Drill Holes:	N/A
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	RF-35TC 1.524mm
Final foil external:	1.5 oz
Final foil internal:	N/A
Final height of PCB:	1.6 mm ±10%
PLATING AND COATING
Surface Finish	Immersion gold
Solder Mask Apply To:	Bottom, 12micron Minimum
Solder Mask Color:	Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	Bottom
Colour of Component Legend	White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	N/A
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Data Sheet of RF-35TC

RF-35TC TYPICAL VALUES
Property	Test Method	Unit	Value	Unit	Value
DK @10 GHz	IPC-650 2.5.5.5.1(modified)		3.5		3.5
Tck(-30 to 120℃)	IPC-650 2.5.5.5.1(modified)	ppm	24	ppm	24
Df @10 GHz	IPC-650 2.5.5.5.1(modified)		0.0011		0.0011
Dielectric Breakdown	IPC-650 2.5.6(in-Plane,Two Pins in Oil)	kV	56.7	kV	56.7
Dielectric Strength	ASTM D 149(Through Plane)	V/mil	570	V/mm	22,441
Arc Resistance	IPC-650 2.5.1	Seconds	304	Seconds	304
Moisture Absorption	IPC-650 2.6.2.1	%	0.05	%	0.05
Flexural Strength(MD)	ASTM D 790/IPC-650 2.4.4	psi	12,900	N/mm2	88.94
Flexural Strength(CD)	ASTM D 790/IPC-650 2.4.4	psi	11,700	N/mm2	80.67
Tensile Strength(MD)	ASTM D 3039/IPC-TM-650 2.4.19	psi	9,020	N/mm2	62.19
Tensile Strength(CD)	ASTM D 3039/IPC-TM-650 2.4.19	psi	7,740	N/mm2	53.37
Elongation at Break(MD)	ASTM D 3039/IPC-TM-650 2.4.19	%	1.89	N/mm	1.89
Elongation at Break(CD)	ASTM D 3039/IPC-TM-650 2.4.19	%	1.7	%	1.7
Young's Modulus(MD)	ASTM D 3039/IPC-TM-650 2.4.19	psi	667,000	N/mm2	4,599
Young's Modulus(CD)	ASTM D 3039/IPC-TM-650 2.4.19	psi	637,000	N/mm2	4,392
Poisson's Ratio(MD)	ASTM D 3039/IPC-TM-650 2.4.19		0.18		0.18
Poisson's Ratio(CD)	ASTM D 3039/IPC-TM-650 2.4.19		0.23		0.18
Compressive Modulus	ASTM D 695(23℃)	psi	560,000	N/mm2	3,861
Flexural Strength(MD)	ASTM D 790/IPC-650 2.4.4	psi	1.46 x 106	N/mm2	10,309
Flexural Strength(CD)	ASTM D 790/IPC-650 2.4.4	psi	1.50 x 106	N/mm2	10,076
Peel Stength(½ oz.CVH)	IPC-650 2.4.8(Thermal Stress.)	Ibs./inch	7	g/cm3	1.25
Thermal Conductivity(Unclad,125℃)	ASTM F433(Guarded Heat Flow)	W/(mK)	0.6	W/(mK)	0.6
Thermal Conductivity(C1/C1,125℃)	ASTM F433(Guarded Heat Flow)	W/(mK)	0.92	W/(mK)	0.92
Thermal Conductivity(CH/CH,125℃)	ASTM F433(Guarded Heat Flow)	W/(mK)	0.87	W/(mK)	0.87
Dimensional Stability(MD)	IPC-650-2.4.39 Sec.5.4(After Etch)	mils/in.	0.23	mm/M	0.23
Dimensional Stability(CD)	IPC-650-2.4.39 Sec.5.4(After Etch)	mils/in.	0.64	mm/M	0.64
Dimensional Stability(MD)	IPC-650-2.4.39 Sec.5.5(Thermal Stress.)	mils/in.	-0.04	mm/M	-0.04
Dimensional Stability(CD)	IPC-650-2.4.39 Sec.5.5(Thermal Stress.)	mils/in.	0.46	mm/M	0.46
Surface Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms	8.33 x 107	Mohms	8.33 x 107
Surface Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms	6.42 x 107	Mohms	6.42 x 107
Volume Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms/cm	5.19 x 108	Mohms/cm	5.19 x 108
Volume Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms/cm	2.91 x 108	Mohms/cm	2.91 x 108
CTE(X axis)(25-260℃)	IPC-650 2.4.41/ASTM D 3386	ppm/℃	11	ppm/℃	11
CTE(Y axis)(25-260℃)	IPC-650 2.4.41/ASTM D 3386	ppm/℃	13	ppm/℃	13
CTE(Z axis)(25-260℃)	IPC-650 2.4.41/ASTM D 3386	ppm/℃	34	ppm/℃	34
Density	ASTM D 792	g/cm3	2.35	g/cm3	2.35
Hardness	ASTM D 2240(Shore D)		79.1		79.1
Strain at Break(MD)	ASTM D 790/IPC-650 2.4.4	%	0.014	%	0.014
Strain at Break(CD)	ASTM D 790/IPC-650 2.4.4	%	0.013	%	0.013
Specific Heat	ASTM E 1269-05,E 967-08,E968-02	j/(g℃)	0.94	j/(g℃)	0.94
Td(2% Weight Loss)	IPC-650 2.4.24.6/TGA	oF	788	℃	420
Td(5% Weight Loss)	IPC-650 2.4.24.6/TGA	oF	817	℃	436

Taconic High Frequency PCB Built on RF-35TC 60mil 1.524mm With Immersion Gold for Satellites

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