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RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203 TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450,

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Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880

Shenzhen Bicheng Electronics Technology Co., Ltd
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    Buy cheap Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880 from wholesalers
     
    Buy cheap Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880 from wholesalers
    • Buy cheap Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880 from wholesalers
    • Buy cheap Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880 from wholesalers

    Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880

    Ask Lasest Price
    Brand Name : Bicheng Technologies Limited
    Model Number : BIC-0073-V1.12
    Certification : UL
    Price : USD 2.99-9.99 PER PIECE
    Payment Terms : T/T, Western Union
    Supply Ability : 45000 pieces per month
    Delivery Time : 10 working days
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    Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880

    Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880

    (PCB's are custom-made products, the picture and parameters shown are just for reference)


    Hello everyone,

    Warm greetings!


    The hybrid PCB can be a mixture of FR-4 and high frequency material, and a mixture of high frequency material with different dielectric constant (DK), for example RT/duroid 5880 and RO4350B etc.


    Today we’ll talk about a type of mixed high frequency PCB made on 13.3mil (0.338mm) RO4350B and 31mil (0.787mm) RT/duroid 5880. It’s for the application of multi-coupler antenna.



    This is a 3-layer board that one layer is etched off.


    The basic specifications are as follows:

    Base material: RO4350B 13.3mil (0.338mm) + RT/duroid 5880 31 mil (0.787mm)

    Dielectric constant: 3.48+/-0.05

    Layer count: 3 layers

    Via type: Through holes, blind vias

    Format: 160mm x 90mm = 1 type = 1 piece

    Surface finish: Immersion gold

    Copper weight: Outer layer 35μm | Inner layer 35μm

    Solder mask / Legend: Green / White

    Final PCB height: 1.3 mm

    Standard: IPC 6012 Class 2

    Packing: 20 panels are packed for shipment.

    Lead time: 20 working days

    Shelf life: 6 months


    Features and benefits

    1) Lowest electrical loss for reinforeced PTFE material

    2) Enhanced electrical performance;

    3) 16000 square meter workshop;

    4) 30000 square meter month capability;

    5) 8000 types of PCB's per month;

    6) More than 17 years of PCB experience;


    Applications

    Point to Point Digital Radio Antennas, WiFi Amplifier, Tower-mounted Booster, Power Amplifier, RF Module


    Properties of RT/duroid 5880

    RT/duroid 5880 Typical Value
    PropertyRT/duroid 5880DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess2.20
    2.20±0.02 spec.
    ZN/AC24/23/50
    C24/23/50
    1 MHz IPC-TM-650 2.5.5.3
    10 GHz IPC-TM 2.5.5.5
    Dielectric Constant,εDesign2.2ZN/A8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.0004
    0.0009
    ZN/AC24/23/50
    C24/23/50
    1 MHz IPC-TM-650 2.5.5.3
    10 GHz IPC-TM 2.5.5.5
    Thermal Coefficient of ε-125Zppm/-50to 150IPC-TM-650 2.5.5.5
    Volume Resistivity2 x 107ZMohm cmC/96/35/90ASTM D 257
    Surface Resistivity3 x 107ZMohmC/96/35/90ASTM D 257
    Specific Heat0.96(0.23)N/Aj/g/k
    (cal/g/c)
    N/ACalculated
    Tensile ModulusTest at 23Test at 100N/AMPa(kpsi)AASTM D 638
    1070(156)450(65)X
    860(125)380(55)Y
    Ultimate Stress29(4.2)20(2.9)X
    27(3.9)18(2.6)Y
    Ultimate Strain67.2X%
    4.95.8Y
    Compressive Modulus710(103)500(73)XMPa(kpsi)AASTM D 695
    710(103)500(73)Y
    940(136)670(97)Z
    Ultimate Stress27(3.9)22(3.2)X
    29(5.3)21(3.1)Y
    52(7.5)43(6.3)Z
    Ultimate Strain8.58.4X%
    7.77.8Y
    12.517.6Z
    Moisture Absorption0.02N/A%0.62"(1.6mm) D48/50ASTM D 570
    Thermal Conductivity0.2ZW/m/k80ASTM C 518
    Coefficient of Thermal Expansion31
    48
    237
    X
    Y
    Z
    ppm/0-100IPC-TM-650 2.4.41
    Td500N/A TGAN/AASTM D 3850
    Density2.2N/Agm/cm3N/AASTM D 792
    Copper Peel31.2(5.5)N/APli(N/mm)1oz(35mm)EDC foil
    after solder float
    IPC-TM-650 2.4.8
    FlammabilityV-0N/AN/AN/AUL 94
    Lead-free Process CompatibleYesN/AN/AN/AN/A
    Quality Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880 for sale
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