RF-10 PCB: 2-Layer, 10mil Core, Immersion Gold Finish
(All PCBs are custom-manufactured. Reference images and parameters
may vary based on your design requirements.)
Overview of the 2-Layer RF-10 PCB
The 2-layer RF-10 PCB is a high-performance, ceramic-filled PTFE
laminate designed for RF and microwave applications requiring high
dielectric constant (Dk), low insertion loss, and outstanding
dimensional stability. With its 10mil (0.254mm) core, immersion
gold (ENIG) surface finish, and precise construction, this PCB
supports miniaturized designs for high-frequency applications like
microstrip patch antennas, GPS systems, and satellite components.
PCB Construction Details
| Parameter | Specification |
| Base Material | RF-10 |
| Layer Count | 2 layers |
| Board Dimensions | 45mm x 50mm ± 0.15mm |
| Minimum Trace/Space | 6/5 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 0.3mm |
| Copper Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold (ENIG) |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Electrical Testing | 100% tested prior to shipment |
PCB Stackup
| Layer | Material | Thickness |
| Copper Layer 1 | Copper (1oz) | 35 μm |
| Core Material | RF-10 Ceramic PTFE | 10mil (0.254mm) |
| Copper Layer 2 | Copper (1oz) | 35 μm |
PCB Statistics
The compact 2-layer RF-10 PCB is designed for simplified but
reliable layouts. Below are the key statistics:
- Components: 7
- Total Pads: 29
- Thru Hole Pads: 21
- Top SMT Pads: 8
- Bottom SMT Pads: 0
- Vias: 14
- Nets: 2
Introduction to RF-10 Material
RF-10 laminates are composites of ceramic-filled PTFE reinforced
with woven fiberglass. These materials are engineered to deliver
high dielectric constant, low dissipation factor, and excellent
dimensional stability.
Key attributes include:
- High thermal conductivity: Efficient heat dissipation for thermal
management.
- Low dissipation factor: Minimizes signal loss at high frequencies.
- Tight Dk tolerance: Ensures consistent performance across
applications.
Features of RF-10
- Dielectric Constant (Dk): 10.2 ± 0.3 at 10GHz
- Dissipation Factor (Df): 0.0025 at 10GHz
- Thermal Conductivity: 0.85 W/mK (unclad)
- Coefficient of Thermal Expansion (CTE): X-axis: 16 ppm/°C, Y-axis:
20 ppm/°C, Z-axis: 25 ppm/°C
- Moisture Absorption: 0.08%
- Flammability Rating: UL-94 V0
Benefits of RF-10 PCB
- High Dielectric Constant (Dk): Enables size reduction for RF
circuits.
- Low Dissipation Factor: Minimizes phase shift and insertion loss.
- High Thermal Conductivity: Improves heat dissipation for better
performance.
- Excellent Dimensional Stability: Ensures high production yields and
reliability.
- Smooth Copper Bonding: Reduces skin-effect losses at high
frequencies.
- Low Moisture Absorption: Maintains performance in humid
environments.
- Cost-Effective: Delivers excellent performance at a competitive
price.
Applications of RF-10 PCB
- Microstrip Patch Antennas
- GPS Antennas
- Passive Components:
- Aircraft Collision Avoidance Systems
- Satellite Components
Why Choose the 2-Layer RF-10 PCB?
The 2-layer RF-10 PCB is a reliable solution for high-frequency
circuit designs requiring low loss, compact size, and thermal
stability. Its 10mil core, ENIG finish, and high Dk make it an
ideal choice for aerospace, telecommunications, and satellite
systems.
Contact us today to learn more about this high-performance PCB or
to place your order!
