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RO4730G3 2-Layer CCL 0.6mm Thick built for Hybrid, Multilayer PCB with ENIG Finish using in Cellular Base Station Antennas

Shenzhen Bicheng Electronics Technology Co., Ltd
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    Buy cheap RO4730G3 2-Layer CCL 0.6mm Thick built for Hybrid, Multilayer PCB with ENIG Finish using in Cellular Base Station Antennas from wholesalers
     
    Buy cheap RO4730G3 2-Layer CCL 0.6mm Thick built for Hybrid, Multilayer PCB with ENIG Finish using in Cellular Base Station Antennas from wholesalers
    • Buy cheap RO4730G3 2-Layer CCL 0.6mm Thick built for Hybrid, Multilayer PCB with ENIG Finish using in Cellular Base Station Antennas from wholesalers
    • Buy cheap RO4730G3 2-Layer CCL 0.6mm Thick built for Hybrid, Multilayer PCB with ENIG Finish using in Cellular Base Station Antennas from wholesalers
    • Buy cheap RO4730G3 2-Layer CCL 0.6mm Thick built for Hybrid, Multilayer PCB with ENIG Finish using in Cellular Base Station Antennas from wholesalers

    RO4730G3 2-Layer CCL 0.6mm Thick built for Hybrid, Multilayer PCB with ENIG Finish using in Cellular Base Station Antennas

    Ask Lasest Price
    Brand Name : Rogers
    Model Number : RO4730G3
    Certification : ISO9001
    Price : 7USD/PCS
    Payment Terms : T/T, Paypal
    Supply Ability : 50000pcs
    Delivery Time : 2-10 working days
    • Product Details
    • Company Profile

    RO4730G3 2-Layer CCL 0.6mm Thick built for Hybrid, Multilayer PCB with ENIG Finish using in Cellular Base Station Antennas

    RO4730G3 2-Layer PCB: 0.6mm Thick with ENIG Finish


    The RO4730G3 2-layer PCB is a cost-effective and high-performance solution for antenna-grade applications. With its low-loss dielectric and lightweight properties, it is ideal for cellular base station antennas and other RF designs. The use of Electroless Nickel Immersion Gold (ENIG) ensures excellent solderability and durability.



    Key Construction Details

    ParameterSpecification
    Base MaterialRogers RO4730G3
    Layer Count2 layers
    Board Dimensions59.6mm x 40.5mm (± 0.15mm)
    Minimum Trace/Space5/5 mils
    Minimum Hole Size0.4mm
    Blind ViasNone
    Finished Thickness0.6mm
    Copper Weight1oz (35μm) on both layers
    Via Plating Thickness20μm
    Surface FinishElectroless Nickel Immersion Gold (ENIG)
    Top SilkscreenWhite
    Top Solder MaskGreen
    Bottom Solder MaskNone
    Electrical Testing100% tested before shipment

    Features of RO4730G3 Material

    1. Dielectric Constant (Dk): 3.0 ± 0.05 at 10GHz for low-loss performance.
    2. Dissipation Factor (Df): 0.0028 at 10GHz for minimal signal loss.
    3. Thermal Conductivity: 0.45W/mK for effective heat dissipation.
    4. Thermal Coefficient of Dk: 34 ppm/°C for consistent circuit performance.
    5. Coefficient of Thermal Expansion (CTE): X-axis: 15.9 ppm/°C, Y-axis: 14.4 ppm/°C, Z-axis: 35.2 ppm/°C
    6. High Tg: >280°C for thermal reliability.
    7. Decomposition Temperature (Td): 411°C for excellent durability.


    Why Choose RO4730G3 PCB?

    Cost-Effective: Affordable alternative to PTFE-based laminates with similar performance.

    High-Frequency Stability: Ensures minimal signal loss and reliable operation.

    Easy Manufacturing: Compatible with standard processing methods, reducing costs and complexity.

    Lightweight and Durable: Perfect for high-performance, weight-sensitive designs.


    The RO4730G3 2-layer PCB is the ideal choice for antenna-grade and RF applications, offering excellent performance, lightweight design, and cost efficiency. Contact us today to learn more!


    Quality RO4730G3 2-Layer CCL 0.6mm Thick built for Hybrid, Multilayer PCB with ENIG Finish using in Cellular Base Station Antennas for sale
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