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6-Layer RO4003C/Tg170 FR-4 PCB with 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask

Shenzhen Bicheng Electronics Technology Co., Ltd
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    Buy cheap 6-Layer RO4003C/Tg170 FR-4 PCB with 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask from wholesalers
     
    Buy cheap 6-Layer RO4003C/Tg170 FR-4 PCB with 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask from wholesalers
    • Buy cheap 6-Layer RO4003C/Tg170 FR-4 PCB with 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask from wholesalers
    • Buy cheap 6-Layer RO4003C/Tg170 FR-4 PCB with 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask from wholesalers
    • Buy cheap 6-Layer RO4003C/Tg170 FR-4 PCB with 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask from wholesalers

    6-Layer RO4003C/Tg170 FR-4 PCB with 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask

    Ask Lasest Price
    Brand Name : Rogers
    Model Number : RO4003C/Tg170 FR-4 PCB
    Certification : ISO9001
    Price : 2.99USD/pcs
    Payment Terms : T/T, Paypal
    Supply Ability : 50000pcs
    Delivery Time : 2-10 working days
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    6-Layer RO4003C/Tg170 FR-4 PCB with 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask

    6-Layer RO4003C/Tg170 FR-4 PCB: 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask


    Overview of the 6-Layer RO4003C/Tg170 FR-4 PCB


    The 6-Layer RO4003C/Tg170 FR-4 PCB is a highly durable and performance-optimized printed circuit board designed for demanding applications in cellular base stations, automotive radar, and RF systems. This PCB combines Rogers RO4003C and Tg170 FR-4 cores, offering exceptional thermal stability, low dielectric loss, and dimensional reliability. With 6.8mm finished thickness, immersion gold surface finish, and controlled-depth slots, the design ensures long-term reliability and optimal signal performance for high-frequency devices.


    This multi-layer PCB is manufactured to IPC-Class-2 standards, ensuring consistent quality and worldwide availability. It's perfect for performance-sensitive, high-volume applications where precise electrical and thermal properties are critical.



    PCB Construction Details

    The 6-layer rigid PCB is built with a mix of RO4003C high-frequency laminate and Tg170 FR-4, providing a blend of high thermal conductivity and cost-effective manufacturability. Below is a detailed table of its construction specifications:

    ParameterSpecification
    Base MaterialRO4003C / Tg170 FR-4
    Layer Count6 Layers
    Board Dimensions495mm x 345mm ± 0.15mm
    Minimum Trace/Space5/6 mils
    Minimum Hole Size0.8mm
    Blind ViasNo
    Finished Thickness6.8mm
    Copper Weight1oz (1.4 mils) outer & inner layers
    Via Plating Thickness20 μm
    Surface FinishImmersion Gold
    Top SilkscreenNo
    Bottom SilkscreenNo
    Top Solder MaskNo
    Bottom Solder MaskNo
    Depth-Controlled SlotsTop and Bottom Layers
    Electrical Testing100% tested prior to shipment

    PCB Stackup

    The stackup for this 6-layer rigid PCB alternates between high-performance RO4003C and cost-efficient Tg170 FR-4, ensuring thermal stability and dielectric uniformity. The detailed layer structure is as follows:

    LayerMaterialThickness
    Copper Layer 1Copper (1oz)35 μm
    Core MaterialTg170 FR-4 Core3.0mm
    Copper Layer 2Copper (1oz)35 μm
    Bonding PlyEpoxy Resin (4mil)0.102mm
    Copper Layer 3Copper (1oz)35 μm
    Core MaterialRogers RO4003C Core0.305mm
    Copper Layer 4Copper (1oz)35 μm
    Bonding PlyEpoxy Resin (4mil)0.102mm
    Copper Layer 5Copper (1oz)35 μm
    Core MaterialTg170 FR-4 Core3.0mm
    Copper Layer 6Copper (1oz)35 μm

    PCB Statistics

    The 6-layer RO4003C/Tg170 FR-4 PCB is optimized for high-density component placement and reliable signal routing. Below are its key statistics:

    • Components: 132
    • Total Pads: 456
    • Thru Hole Pads: 271
    • Top SMT Pads: 166
    • Bottom SMT Pads: 19
    • Vias: 131
    • Nets: 17

    Introduction to RO4003C

    The Rogers RO4003C laminate is a woven glass-reinforced hydrocarbon/ceramic material that offers the electrical performance of PTFE but with the manufacturability of epoxy-glass laminates. Its low dielectric constant (Dk) of 3.38 ± 0.05 and dissipation factor of 0.0027 at 10GHz make it ideal for high-frequency applications.


    Key features of RO4003C include:

    1. Low moisture absorption (0.06%) for reliable performance in humid environments.
    2. Stable thermal expansion (CTE), ensuring excellent dimensional stability.
    3. High thermal conductivity (0.71 W/m/K) for effective heat dissipation.

    Applications

    This PCB is ideal for applications requiring high-frequency stability and reliability, such as:

    1. Cellular Base Station Antennas
    2. Automotive Radar and Sensors
    3. RF Identification Tags
    4. LNBs for Direct Broadcast Satellites

    With its 6-layer construction, RO4003C core, and immersion gold finish, the 6-layer RO4003C/Tg170 FR-4 PCB is the perfect choice for demanding RF and microwave systems. Its combination of durability, performance, and cost-efficiency makes it a standout solution for high-volume, performance-critical applications.


    Quality 6-Layer RO4003C/Tg170 FR-4 PCB with 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask for sale
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