F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold
(PCB's are custom-made products, the picture and parameters shown
are just for reference)
Brief Introduction
This is a 2-layer high frequency printed circuit boards(PCB) built
on Wangling F4BTME320 substrates. Both top layer and bottom layer
feature 70 µm (2 oz) copper starting from 1oz plating. It supports
surface mount components on top side, while through-hole components
are not utilized in this design.
The technology specifications highlight a minimum trace width of 4
mil and a minimum spacing of 6 mil, allowing for precise circuit
design. The surface finish is Immersion Gold, which not only
enhances solderability but also provides excellent corrosion
resistance. Additionally, a black solder mask is applied to the top
side of the PCB, offering both durability and an appealing
aesthetic while safeguarding the underlying circuitry from
environmental factors.
Here are the details in the table below.
| PCB SIZE | 70 x 70mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 70 um(1 oz+plate) TOP layer |
| F4BTME320 - 1.0mm |
| copper ------- 70um(1 oz + plate) BOT Layer |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 6 mil |
| Minimum / Maximum Holes: | 0.4 mm / 1.2 mm |
| Number of Different Holes: | 7 |
| Number of Drill Holes: | 92 |
| Number of Milled Slots: | 2 |
| Number of Internal Cutouts: | 1 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | F4BTME320 Dk3.2 |
| Final foil external: | 2 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 1.1 mm ±10% |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold |
| Solder Mask Apply To: | Top, Black |
| Solder Mask Color: | no |
| Solder Mask Type: | no |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | Top |
| Colour of Component Legend | White |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), minimum size 0.4mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
F4BTME High Frequency Laminates
F4BTME high frequency laminates are made of glass fiber cloth,
nano-ceramic filling and polytetrafluoroethylene resin after
scientific preparation and strict process pressing.
This series products is based on the F4BM dielectric layer, and the
materials are added with high-dielectric and low-loss nanoscale
ceramics, thus obtaining higher dielectric constant, better heat
resistance, lower coefficient of thermal expansion, higher
insulation resistance, better thermal conductivity, while
maintaining the characteristics of low loss.
F4BTME is cladded with reverse treated copper foil (RTF) which has
excellent PIM index, more accurate line control and lower conductor
loss, optional thickness available with0.5oz and 1oz.
Data Sheet (F4BTME)
| Product Technical Parameters | Product Model & Data Sheet |
| Product Features | Test Conditions | Unit | F4BME217 | F4BME220 | F4BME233 | F4BME245 | F4BME255 | F4BME265 | F4BME275 | F4BME294 | F4BME300 |
| Dielectric Constant (Typical) | 10GHz | / | 2.17 | 2.2 | 2.33 | 2.45 | 2.55 | 2.65 | 2.75 | 2.94 | 3.0 |
| Dielectric Constant Tolerance | / | / | ±0.04 | ±0.04 | ±0.04 | ±0.05 | ±0.05 | ±0.05 | ±0.05 | ±0.06 | ±0.06 |
| Loss Tangent (Typical) | 10GHz | / | 0.001 | 0.001 | 0.0011 | 0.0012 | 0.0013 | 0.0013 | 0.0015 | 0.0016 | 0.0017 |
| 20GHz | / | 0.0014 | 0.0014 | 0.0015 | 0.0017 | 0.0018 | 0.0019 | 0.0021 | 0.0023 | 0.0025 |
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -150 | -142 | -130 | -120 | -110 | -100 | -92 | -85 | -80 |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 |
| 1 OZ F4BME | N/mm | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 |
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >23 | >23 | >23 | >25 | >25 | >25 | >28 | >30 | >30 |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >30 | >30 | >32 | >32 | >34 | >34 | >35 | >36 | >36 |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 25, 34 | 25, 34 | 22, 30 | 20, 25 | 16, 21 | 14, 17 | 14, 16 | 12, 15 | 12, 15 |
| Z direction | -55 º~288ºC | ppm/ºC | 240 | 240 | 205 | 187 | 173 | 142 | 112 | 98 | 95 |
| Thermal Stress | 260℃, 10s,3 times | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination |
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 |
| Density | Room Temperature | g/cm3 | 2.17 | 2.18 | 2.20 | 2.22 | 2.25 | 2.25 | 2.28 | 2.29 | 2.29 |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 |
| Thermal Conductivity | Z direction | W/(M.K) | 0.24 | 0.24 | 0.28 | 0.30 | 0.33 | 0.36 | 0.38 | 0.41 | 0.42 |
| PIM | Only applicable to F4BME | dBc | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 |
| Material Composition | / | / | PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated
(RTF) copper foil. |
Our PCB Capability (F4BTME)
| PCB Material: | PTFE / glass fiber cloth / Nano-ceramic filler |
| Designation (F4BTME ) | F4BTM | DK (10GHz) | DF (10 GHz) |
| F4BTME298 | 2.98±0.06 | 0.0018 |
| F4BTME300 | 3.0±0.06 | 0.0018 |
| F4BTME320 | 3.2±0.06 | 0.0020 |
| F4BTME350 | 3.5±0.07 | 0.0025 |
| Layer count: | Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness (or overall thickness) | 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm,
2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure
gold, ENEPIG etc.. |
